参数资料
型号: AD7687BRMZ
厂商: Analog Devices Inc
文件页数: 17/28页
文件大小: 0K
描述: IC ADC 16BIT 250KSPS 10-MSOP
标准包装: 50
系列: PulSAR®
位数: 16
采样率(每秒): 250k
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 12.5mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-MSOP
包装: 管件
输入数目和类型: 1 个差分,双极
产品目录页面: 778 (CN2011-ZH PDF)
配用: EVAL-AD7687CBZ-ND - BOARD EVALUATION FOR AD7687
AD7687
Data Sheet
Rev. B | Page 24 of 28
APPLICATION HINTS
LAYOUT
The printed circuit board that houses the AD7687 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7687, with all its analog signals on the left side and all its
digital signals on the right side, eases this task.
Avoid running digital lines under the device because these
couple noise onto the die, unless a ground plane under the
AD7687 is used as a shield. Fast switching signals, such as CNV
or clocks, should never run near analog signal paths. Crossover
of digital and analog signals should be avoided
At least one ground plane should be used. It could be common
or split between the digital and analog sections. In the latter
case, the planes should be joined underneath the AD7687s.
The AD7687 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, and ideally right up against, the REF
and GND pins and connecting it with wide, low impedance
traces.
Finally, the power supplies VDD and VIO of the AD7687
should be decoupled with ceramic capacitors (typically 100 nF)
placed close to the AD7687 and connected using short and wide
traces to provide low impedance paths and reduce the effect of
glitches on the power supply lines.
An example of layout following these rules is shown in
EVALUATING THE AD7687’S PERFORMANCE
Other recommended layouts for the AD7687 are outlined
in the documentation of the evaluation board for the AD7687
(EVAL-AD7687). The evaluation board package includes
a fully assembled and tested evaluation board, documentation,
and software for controlling the board from a PC via the
EVAL-CONTROL BRD3.
02972-046
Figure 47. Example of Layout of the AD7687 (Top Layer)
02972-047
Figure 48. Example of Layout of the AD7687 (Bottom Layer)
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