参数资料
型号: AD7687BRMZRL7
厂商: Analog Devices Inc
文件页数: 26/28页
文件大小: 0K
描述: IC ADC 16BIT 250KSPS 10MSOP
标准包装: 1,000
系列: PulSAR®
位数: 16
采样率(每秒): 250k
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 12.5mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-MSOP
包装: 带卷 (TR)
输入数目和类型: 1 个差分,双极
配用: EVAL-AD7687CBZ-ND - BOARD EVALUATION FOR AD7687
Data Sheet
AD7687
Rev. B | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 6.
Parameter
Rating
Analog Inputs
GND 0.3 V to VDD + 0.3 V
or ±130 mA
REF
GND 0.3 V to VDD + 0.3 V
Supply Voltages
VDD, VIO to GND
0.3 V to +7 V
VDD to VIO
±7 V
Digital Inputs to GND
0.3 V to VIO + 0.3 V
Digital Outputs to GND
0.3 V to VIO + 0.3 V
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Lead Temperature Range
JEDEC J-STD-20
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
θJA
θJC
Unit
10-Lead QFN (LFCSP)
84
2.96
°C/W
10-Lead MSOP
200
44
°C/W
1 See the Analog Input section.
ESD CAUTION
500
μAI
OL
500
μAI
OH
1.4V
TO SDO
CL
50pF
02972-
003
Figure 3. Load Circuit for Digital Interface Timing
30% VIO
70% VIO
2V OR VIO – 0.5V1
0.8V OR 0.5V2
2V OR VIO – 0.5V1
tDELAY
02972-
004
12V IF VIO ABOVE 2.5V, VIO – 0.5V IF VIO BELOW 2.5V.
20.8V IF VIO ABOVE 2.5V, 0.5V IF VIO BELOW 2.5V.
Figure 4. Voltage Levels for Timing
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