参数资料
型号: AD7797BRUZ-REEL
厂商: Analog Devices Inc
文件页数: 22/24页
文件大小: 0K
描述: IC ADC 24BIT SIG-DEL 1CH 16TSSOP
标准包装: 2,500
位数: 24
采样率(每秒): 123
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 1
功率耗散(最大): 1.6mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 16-TSSOP
包装: 带卷 (TR)
输入数目和类型: 1 个差分,单极;1 个差分,双极
配用: EVAL-AD7797EBZ-ND - BOARD EVALUATION FOR AD7797
AD7796/AD7797
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
AVDD to GND
0.3 V to +7 V
DVDD to GND
0.3 V to +7 V
Analog Input Voltage to GND
0.3 V to AVDD + 0.3 V
Reference Input Voltage to GND
0.3 V to AVDD + 0.3 V
Digital Input Voltage to GND
0.3 V to DVDD + 0.3 V
Digital Output Voltage to GND
0.3 V to DVDD + 0.3 V
AIN/Digital Input Current
10 mA
Operating Temperature Range
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Maximum Junction Temperature
150°C
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
θJA
θJC
Unit
TSSOP
128
14
°C/W
ESD CAUTION
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