参数资料
| 型号： | AD7801BRU |
| 厂商： | Analog Devices Inc |
| 文件页数： | 5/16页 |
| 文件大小： | 0K |
| 描述： | IC DAC 8BIT PARALLEL INP 20TSSOP |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 标准包装： | 75 |
| 设置时间： | 1.2µs |
| 位数： | 8 |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 电压电源： | 单电源 |
| 功率耗散（最大）： | 12.9mW |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 20-TSSOP |
| 包装： | 管件 |
| 输出数目和类型： | 1 电压，单极；1 电压，双极 |
| 采样率（每秒）： | 833k |
AD7801
–13–
REV. 0
Power Supply Bypassing and Grounding
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD7801 is mounted should be designed so that the analog and
digital sections are separated and confined to certain areas of the
board. If the AD7801 is in a system where multiple devices
require an AGND to DGND connection, the connection should
be made at one point only, a star ground point which should be
established as closely as possible to the AD7801. The AD7801
should have ample supply bypassing of 10
F in parallel with
0.1
F located as close to the package as possible, ideally right
up against the device. The 10
F capacitors are the tantalum
bead type. The 0.1
F capacitors should have low Effective
Series Resistance (ESR) and Effective Series Inductance (ESI),
such as the common ceramic types, which provide a low
impedance path to ground at high frequencies to handle
transient currents due to internal logic switching.
The power supply lines of the AD7801 should use as large a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the supply line. Fast switching signals like
clocks should be shielded with digital ground to avoid radiating
noise to other parts of the board and should never be run near
reference inputs. Avoid crossover of digital and analog signals.
Traces on opposite sides of the board should run at right angles
to each other. This reduces the effect of feedthrough through
the board. A microstrip technique is by far the best, but not
always possible with a double-sided board. In this technique, the
component side of the board is dedicated to the ground plane
while signal traces are placed on the solder side.
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