参数资料
型号: AD7873BRQZ
厂商: Analog Devices Inc
文件页数: 17/29页
文件大小: 0K
描述: IC ADC 12BIT TOUCHSCREEN 16QSOP
标准包装: 98
类型: 电阻
触摸面板接口: 4 线
输入数/键: 1 TSC
分辨率(位): 12 b
评估套件: 可供
数据接口: 串行
数据速率/采样率 (SPS,BPS): 125k
电压基准: 外部,内部
电源电压: 2.2 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
供应商设备封装: 16-QSOP
包装: 管件
Data Sheet
AD7873
Rev. F | Page 23 of 28
GROUNDING AND LAYOUT
For information on grounding and layout considerations for the
AD7873, refer to Application Note AN-577, Layout and
Grounding Recommendations for Touch Screen Digitizers.
PCB DESIGN GUIDELINES FOR
CHIP SCALE PACKAGE
The lands on the chip scale package (CP-32) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias can be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal
pad to GND.
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相关代理商/技术参数
参数描述
AD7873BRQZ-REEL 功能描述:IC ADC 12BIT TOUCHSCREEN 16QSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 触摸屏控制器 系列:- 标准包装:96 系列:- 类型:- 触摸面板接口:- 输入数/键:- 分辨率(位):- 评估套件:* 数据接口:- 数据速率/采样率 (SPS,BPS):- 电压基准:- 电源电压:- 电流 - 电源:- 工作温度:- 安装类型:表面贴装 封装/外壳:16-TSSOP(0.173",4.40mm 宽) 供应商设备封装:16-TSSOP 包装:带卷 (TR)
AD7873BRQZ-REEL7 功能描述:IC ADC 12BIT TOUCHSCREEN 16QSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 触摸屏控制器 系列:- 标准包装:96 系列:- 类型:- 触摸面板接口:- 输入数/键:- 分辨率(位):- 评估套件:* 数据接口:- 数据速率/采样率 (SPS,BPS):- 电压基准:- 电源电压:- 电流 - 电源:- 工作温度:- 安装类型:表面贴装 封装/外壳:16-TSSOP(0.173",4.40mm 宽) 供应商设备封装:16-TSSOP 包装:带卷 (TR)
AD7874 制造商:AD 制造商全称:Analog Devices 功能描述:LC2MOS 4-Channel, 12-Bit Simultaneous Sampling Data Acquisition System
AD7874AN 功能描述:IC DAS 12BIT 4CH LC2MOS 28-DIP RoHS:否 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
AD7874ANZ 功能描述:IC DAS 12BIT 4CH LC2MOS 28-DIP RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Data Converter Basics 标准包装:1 系列:- 类型:电机控制 分辨率(位):12 b 采样率(每秒):1M 数据接口:串行,并联 电压电源:单电源 电源电压:2.7 V ~ 3.6 V,4.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:100-TQFP 供应商设备封装:100-TQFP(14x14) 包装:剪切带 (CT) 其它名称:296-18373-1