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| 型号： | AD8075Z-EVAL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 9/15页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD8075 |
| 应用说明： | Using the Active Filter Design Tool, AN-649 |
| 标准包装： | 1 |
| 主要目的： | 视频，放大器，三路 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | AD8075 |
| 主要属性： | 缓冲器，550MHz（200 mV），1350 V/us 转换速率 |
| 次要属性： | +/- 4.5 ~ 5.5 V，< 30 mA |
| 已供物品： | 板 |
| 相关产品： | AD8075ARUZ-REEL7-ND - IC TRPL VID BUFF 500MHZ 16-TSSOP AD8075ARUZ-REEL-ND - IC TRPL VID BUFF 500MHZ 16-TSSOP AD8075ARUZ-ND - IC TRPL VID BUFF 500MHZ 16-TSSOP |
AD8074/AD8075
–3–
ABSOLUTE MAXIMUM RATINGS
Supply Voltage
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V
Internal Power Dissipation
AD8074/AD8075 16-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W
Input Voltage
IN0, IN1, IN2 . . . . . . . . . . . . . . . . . . . . . . . . . VEE
≤ V
IN
≤ V
CC
OE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND
≤ V
IN
≤ V
CC
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . Indefinite
3
Storage Temperature Range . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air (T
A = 25
°C).
316-lead plastic TSSOP;
θ
JA = 150.4
°C/W. Maximum internal power dissipa-
tion (PD) should be derated for ambient temperature (T A) such that
PD < (150
°C – T
A)/
θ
JA.
PIN CONFIGURATION
OE
DGND
IN2
AGND
IN1
AGND
IN0
VEE
VCC
OUT2
VEE
OUT1
VCC
OUT0
VEE
AD8074 /AD8075
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
G =
+1/+2
G =
+1/+2
G =
+1/+2
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8074/
AD8075 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150
°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a junc-
tion temperature of 175
°C for an extended period can result in
device failure.
While the AD8074/AD8075 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150
°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 1.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8074/AD8075 features proprietary ESD protection circuitry, permanent damage may occur
on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
AMBIENT TEMPERATURE – C
MAXIMUM
POWER
DISSIPATION
–
Watts
TJ = 150 C
010
30
50
70
90
0
0.5
1.0
1.5
–50
–30
–10
Figure 1. Maximum Power Dissipation vs. Temperature
Rev. B
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