参数资料
型号: AD8231TCPZ-EP-R7
厂商: Analog Devices Inc
文件页数: 18/20页
文件大小: 0K
描述: IC INSTR AMP PROGR ENH 16LFCSP
标准包装: 1,500
放大器类型: 仪表
电路数: 2
输出类型: 满摆幅
转换速率: 1.1 V/µs
增益带宽积: 7MHz
电流 - 输入偏压: 250pA
电压 - 输入偏移: 4µV
电流 - 电源: 4mA
电流 - 输出 / 通道: 70mA
电压 - 电源,单路/双路(±): 3 V ~ 6 V,±1.5 V ~ 3 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-VQFN 裸露焊盘,CSP
供应商设备封装: 16-LFCSP-VQ EP(4x4)
包装: 带卷 (TR)
AD8231-EP
Rev. 0 | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
Rating
Supply Voltage
6 V
Output Short-Circuit Current
Indefinite1
Input Voltage (Common-Mode)
VS 0.3 V to +VS + 0.3 V
Differential Input Voltage
VS 0.3 V to +VS + 0.3 V
Storage Temperature Range
–65°C to +150°C
Operational Temperature Range
–55°C to +125°C
Package Glass Transition Temperature
130°C
ESD (Human Body Model)
1.5 kV
ESD (Charged Device Model)
1.5 kV
ESD (Machine Model)
0.2 kV
Table 5.
Thermal Pad
θJA
Unit
Soldered to Board
54
°C/W
Not Soldered to Board
96
°C/W
The θJA values in Table 5 assume a 4-layer JEDEC standard
board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θJC at the exposed pad
is 6.3°C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8231-EP is
limited by the associated rise in junction temperature (TJ) on
the die. At approximately 130°C, which is the glass transition
temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit may change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the amplifiers. Exceeding a
temperature of 130°C for an extended period can result in a loss
of functionality.
1 For junction temperatures between 105°C and 130°C, short-circuit operation
beyond 1000 hours can impact part reliability.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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