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| 型号： | AD8231WACPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/24页 |
| 文件大小： | 0K |
| 描述： | IC AMP INST RRO 2.7MHZ 16LFCSP |
| 标准包装： | 5,000 |
| 放大器类型： | 仪表 |
| 电路数： | 2 |
| 输出类型： | 满摆幅 |
| 转换速率： | 1.1 V/µs |
| 增益带宽积： | 7MHz |
| 电流 - 输入偏压： | 250pA |
| 电压 - 输入偏移： | 4µV |
| 电流 - 电源： | 4mA |
| 电流 - 输出 / 通道： | 70mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 6 V，±1.5 V ~ 3 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ EP（4x4） |
| 包装： | 带卷 (TR) |
AD8231
Rev. B | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
Rating
Supply Voltage
6 V
Output Short-Circuit Current
Indefinite1
Input Voltage (Common-Mode)
VS 0.3 V to +VS + 0.3 V
Differential Input Voltage
VS 0.3 V to +VS + 0.3 V
Storage Temperature Range
–65°C to +150°C
Operational Temperature Range
–40°C to +125°C
Package Glass Transition Temperature
130°C
ESD (Human Body Model)
1.5 kV
ESD (Charged Device Model)
1.5 kV
ESD (Machine Model)
0.2 kV
Table 5.
Thermal Pad
θJA
Unit
Soldered to Board
54
°C/W
Not Soldered to Board
96
°C/W
board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θJC at the exposed pad
is 6.3°C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8231 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric perform-
ance of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality.
1 For junction temperatures between 105°C and 130°C, short-circuit operation
beyond 1000 hours can impact part reliability.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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相关代理商/技术参数 |
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| AD8232 | 制造商:AD 制造商全称:Analog Devices 功能描述:Single-Lead, Heart Rate Monitor Front End |
| AD8232ACPZ | 制造商:AD 制造商全称:Analog Devices 功能描述:Single-Lead, Heart Rate Monitor Front End |
| AD8232ACPZ-R7 | 功能描述:仪表放大器 ECG and HRM IC Single Lead RoHS:否 制造商:Texas Instruments 通道数量: 输入补偿电压:150 V 可用增益调整: 最大输入电阻:10 kOhms 共模抑制比（最小值）:88 dB 工作电源电压:2.7 V to 36 V 电源电流:200 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:MSOP-8 封装:Bulk |
| AD8232ACPZ-RL | 功能描述:仪表放大器 ECG and HRM IC Single Lead RoHS:否 制造商:Texas Instruments 通道数量: 输入补偿电压:150 V 可用增益调整: 最大输入电阻:10 kOhms 共模抑制比（最小值）:88 dB 工作电源电压:2.7 V to 36 V 电源电流:200 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:MSOP-8 封装:Bulk |
| AD8232ACPZ-WP | 功能描述:仪表放大器 ECG and HRM IC Single Lead RoHS:否 制造商:Texas Instruments 通道数量: 输入补偿电压:150 V 可用增益调整: 最大输入电阻:10 kOhms 共模抑制比（最小值）:88 dB 工作电源电压:2.7 V to 36 V 电源电流:200 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:MSOP-8 封装:Bulk |
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