参数资料
型号: AD8390AACPZ-R7
厂商: Analog Devices Inc
文件页数: 7/12页
文件大小: 0K
描述: IC AMP DIFF LP LDIST 16LFCSP
标准包装: 1,500
放大器类型: 差分
电路数: 1
输出类型: 差分
转换速率: 300 V/µs
-3db带宽: 60MHz
电流 - 输入偏压: 4µA
电压 - 输入偏移: 1000µV
电流 - 电源: 10mA
电流 - 输出 / 通道: 400mA
电压 - 电源,单路/双路(±): 10 V ~ 24 V,±5 V ~ 12 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-VQFN 裸露焊盘,CSP
供应商设备封装: 16-LFCSP-VQ
包装: 带卷 (TR)
AD8390A
Data Sheet
Rev. B | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (VCC VEE)
26 V
VCOM
VEE < VCOM < VCC
Package Power Dissipation
Maximum Junction Temperature (TJ MAX)
150°C
Operating Temperature Range (TA)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified in still air with exposed pad soldered to 4-layer
JEDEC test board. θJC is specified at the exposed pad.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead LFCSP (CP-16-4)
30.4
16
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8390A is
limited by its junction temperature on the die.
The maximum safe junction temperature of plastic encapsu-
lated devices, as determined by the glass transition temperature
of the plastic, is 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding this
limit for an extended period can result in device failure.
Figure 2 shows the maximum safe power dissipation in
the package vs. the ambient temperature. θJA values are
approximations.
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
0
0.5
1.0
1.5
2.0
2.5
3.0
–25
–15
–5
5
15
25
35
45
55
65
75
85
3.5
TJ = 150°C
07094-
003
Figure 2. Maximum Power Dissipation vs. Temperature
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming that the load RL is referenced
to midsupply, the total drive power is VS/2 × IOUT, part of which
is dissipated in the package and part in the load (VOUT × IOUT).
RMS output voltages should be considered. If RL is referenced to
VEE as in single-supply operation, the total power is VS × IOUT.
In single-supply operation with RL referenced to VEE, the worst
case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more copper in direct contact with the package leads
from PCB traces, through holes, ground, and power planes
reduces θJA.
ESD CAUTION
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