- 您现在的位置：买卖IC网 > PDF目录10157 > AD8398ACPZ-RL (Analog Devices Inc)IC LINE DRIVER DUAL VDSL 16LFCSP PDF资料下载
参数资料
| 型号： | AD8398ACPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC LINE DRIVER DUAL VDSL 16LFCSP |
| 标准包装： | 5,000 |
| 类型： | 驱动器 |
| 驱动器/接收器数： | 2/0 |
| 规程： | xDSL |
| 电源电压： | 12V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-WQ（4x4） |
| 包装： | 带卷 (TR) |
AD8398A
Rev. D | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Power Supplies (VCC VEE)
13.2 V
Power Dissipation
(TJ MAX TA)/θJA
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
150°C
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8398A is limited
by its junction temperature (TJ) on the die. The maximum safe
TJ of plastic encapsulated devices, as determined by the glass
transition temperature of the plastic, is 150°C. Temporarily
exceeding this limit may cause a shift in the parametric
performance due to a change in the stresses exerted on the
die by the package. Exceeding this limit for an extended period
can result in device failure.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP_WQ
on a 4-layer board with six vias connecting the exposed pad to
the GND plane layer.
AMBIENT TEMPERATURE (°C)
M
A
X
IM
UM
P
O
W
E
R
DI
S
IP
AT
IO
N
(
W
)
0
5
0
776
0-
0
03
4
3
2
1
TJ = 150°C
6
–40 –30 –20 –10
0
10
20
30
40
50
60
80
70
THERMAL RESISTANCE
θJA is specified with the device soldered on a JEDEC circuit
board and the thermal pad connected to the GND plane layer
using six vias.
Table 3. Thermal Resistance
Package Type
θJA
Unit
16-Lead LFCSP_WQ
35.6
°C/W
Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature,
4-Layer JEDEC Board with Six Thermal Vias
ESD CAUTION
相关PDF资料 |
PDF描述 |
|---|---|
| 1M7807-15PAGG4 | IC FIFO MEMORY 2048X9 64-TQFP |
| VE-22R-IW-F4 | CONVERTER MOD DC/DC 7.5V 100W |
| LTC1605-2IG#TRPBF | IC A/D CONV 16BIT SAMPLNG 28SSOP |
| LTC1605-2IG#TR | IC ADC 16BIT 5V SAMPLING 28SSOP |
| SN74ACT7807-15PAG | IC SYNC FIFO MEM 2048X9 64-TQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD8398ACPZ-TR | 制造商:Analog Devices 功能描述:DUAL WIDEBAND HI OUTPUT CURRENT OPAMP - Tape and Reel |
| AD83C151C-12 | 制造商:TEMIC 制造商全称:TEMIC Semiconductors 功能描述:CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller |
| AD83C151C-16 | 制造商:TEMIC 制造商全称:TEMIC Semiconductors 功能描述:CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller |
| AD83C151C-20 | 制造商:TEMIC 制造商全称:TEMIC Semiconductors 功能描述:CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller |
| AD83C151C-25 | 制造商:TEMIC 制造商全称:TEMIC Semiconductors 功能描述:CMOS 0 to 36 MHz Single Chip 8-bit Microcontroller |
发布紧急采购，3分钟左右您将得到回复。