参数资料
型号: AD8436JCPZ-WP
厂商: Analog Devices Inc
文件页数: 20/24页
文件大小: 0K
描述: IC CONV TRUE RMS-DC LP 20LFCSP
产品培训模块: Introduction to Analog RMS-to-DC Technology: Converters and Applications
标准包装: 64
电流 - 电源: 325µA
电源电压: ±2.4 V ~ 18 V,4.8 V ~ 36 V
安装类型: 表面贴装
封装/外壳: 20-WFQFN 裸露焊盘,CSP
供应商设备封装: 20-LFCSP-WQ(4x4)
包装: 托盘 - 晶粒

AD8436
OUTLINE DIMENSIONS
4.10
4.00 SQ
0.30
0.25
Data Sheet
PIN 1
INDICATOR
3.90
0.50
BSC
0.20
16
15
20
PIN 1
INDICATOR
EXPOSED
PAD
1
2.65
2.50 SQ
2.35
5
11
0.50
10
6
0.25 MIN
0.80
TOP VIEW
0.40
0.30
BOTTOM VIEW
FOR PROPER CONNECTION OF
0.75
0.70
SEATING
PLANE
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
Figure 49. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 × 4 mm Body, Very Very Thin Quad
(CP-20-10)
Dimensions shown in inches
0.345 (8.76)
0.341 (8.66)
0.337 (8.55)
20
1
11
10
0.158 (4.01)
0.154 (3.91)
0.150 (3.81) 0.244 (6.20)
0.236 (5.99)
0.228 (5.79)
0.065 (1.65)
0.049 (1.25)
0.069 (1.75)
0.053 (1.35)
0.010 (0.25)
0.006 (0.15)
0.020 (0.51)
0.010 (0.25)
0.010 (0.25)
0.004 (0.10)
COPLANARITY
0.004 (0.10)
0.025 (0.64)
BSC
0.012 (0.30)
0.008 (0.20)
SEATING
PLANE
0.050 (1.27)
0.016 (0.41)
0.041 (1.04)
REF
COMPLIANT TO JEDEC STANDARDS MO-137-AD
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 50. 20-Lead Shrink Small Outline Package [QSOP]
(RQ-20)
Dimensions shown in inches and (millimeters)
Rev. B | Page 20 of 24
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