参数资料
型号: AD9216BCPZRL7-65
厂商: Analog Devices Inc
文件页数: 31/40页
文件大小: 0K
描述: IC ADC 10BIT DUAL 65MSPS 64LFCSP
标准包装: 750
位数: 10
采样率(每秒): 65M
数据接口: 并联
转换器数目: 2
功率耗散(最大): 240mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 带卷 (TR)
输入数目和类型: 4 个单端,单极;2 个差分,单极
AD9216
Rev. A | Page 37 of 40
THERMAL CONSIDERATIONS
The AD9216 LFCSP package has an integrated heat slug that
improves the thermal and electrical properties of the package
when locally attached to a ground plane at the PCB. A thermal
(filled) via array to a ground plane beneath the part provides
a path for heat to escape the package, lowering junction
temperature. Improved electrical performance also results
from the reduction in package parasitics due to proximity
of the ground plane. Recommended array is 0.3 mm vias
on 1.2 mm pitch. θJA = 26.4°C/W with this recommended
configuration. Soldering the slug to the PCB is a require-
ment for this package.
04775-047
Figure 60. Thermal Via Array
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