参数资料
型号: AD9245BCPZRL7-20
厂商: Analog Devices Inc
文件页数: 32/32页
文件大小: 0K
描述: IC ADC 14BIT SGL 20MSPS 32LFCSP
标准包装: 1,500
位数: 14
采样率(每秒): 20M
数据接口: 并联
转换器数目: 3
功率耗散(最大): 90mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘,CSP
供应商设备封装: 32-LFCSP-VQ(5x5)
包装: 带卷 (TR)
输入数目和类型: 2 个单端,单极;1 个差分,单极
Data Sheet
AD9245
Rev. E | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
With Respect to
Min
Max
Unit
ELECTRICAL
AVDD
AGND
–0.3
+3.9
V
DRVDD
DGND
–0.3
+3.9
V
AGND
DGND
–0.3
+0.3
V
AVDD
DRVDD
–3.9
+3.9
V
D0 to D13
DGND
–0.3
DRVDD + 0.3
V
CLK, MODE
AGND
–0.3
AVDD + 0.3
V
VIN+, VIN–
AGND
–0.3
AVDD + 0.3
V
VREF
AGND
–0.3
AVDD + 0.3
V
SENSE
AGND
–0.3
AVDD + 0.3
V
REFT, REFB
AGND
–0.3
AVDD + 0.3
V
PDWN
AGND
–0.3
AVDD + 0.3
V
ENVIRONMENTAL
Storage Temperature Range
–65
+125
°C
Operating Temperature Range
–40
+85
°C
Lead Temperature
(Soldering 10 sec)
300
°C
Junction Temperature
150
°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions on a 4-layer board
in still air, in accordance with EIA/JESD51-1.
Table 8. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead LFCSP
32.5
32.71
°C/W
Airflow increases heat dissipation, effectively reducing θJA.
In addition, more metal directly in contact with the package
leads from metal traces, through holes, ground, and power
planes reduces the θJA. It is recommended that the exposed
paddle be soldered to the ground plane for the LFCSP package.
There is an increased reliability of the solder joints, and
maximum thermal capability of the package is achieved with
the exposed paddle soldered to the customer board.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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