参数资料
型号: AD9778ABSVZRL
厂商: Analog Devices Inc
文件页数: 56/56页
文件大小: 0K
描述: DAC 14BIT 1.0GSPS 100-TQFP
产品培训模块: DAC Architectures
标准包装: 1,000
位数: 14
数据接口: 并联
转换器数目: 2
电压电源: 模拟和数字
功率耗散(最大): 300mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 100-TQFP 裸露焊盘
供应商设备封装: 100-TQFP-EP(14x14)
包装: 带卷 (TR)
输出数目和类型: 4 电流,单极;4 电流,双极
采样率(每秒): 1G
AD9776A/AD9778A/AD9779A
Rev. B | Page 9 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
With Respect To
Rating
AVDD33, DVDD33
AGND, DGND,
CGND
0.3 V to +3.6 V
DVDD18, CVDD18
AGND, DGND,
CGND
0.3 V to +2.1 V
AGND
DGND, CGND
0.3 V to +0.3 V
DGND
AGND, CGND
0.3 V to +0.3 V
CGND
AGND, DGND
0.3 V to +0.3 V
I120, VREF, IPTAT
AGND
0.3 V to
AVDD33 + 0.3 V
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
AGND
1.0 V to
AVDD33 + 0.3 V
P1D[15:0], P2D[15:0]
DGND
0.3 V to
DVDD33 + 0.3 V
DATACLK, TXENABLE
DGND
0.3 V to
DVDD33 + 0.3 V
REFCLK+, REFCLK
CGND
0.3 V to
CVDD18 + 0.3 V
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O,
SYNC_I+, SYNC_I,
CSB, SCLK, SDIO, SDO
DGND
0.3 V to
DVDD33 + 0.3 V
Junction Temperature
+125°C
Storage Temperature
Range
65°C to +150°C
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP package.
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θJA.
Table 6. Thermal Resistance
Package Type
θJA
θJB
θJC
Unit
100-Lead TQFP
EPAD Soldered
19.1
12.4
7.1
°C/W
EPAD Not Soldered
27.4
°C/W
ESD CAUTION
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