参数资料
型号: AD9858BSVZ
厂商: Analog Devices Inc
文件页数: 22/32页
文件大小: 0K
描述: IC DDS DAC 10BIT 1GSPS 100-TQFP
产品培训模块: Direct Digital Synthesis Tutorial Series (1 of 7): Introduction
Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action
Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter
Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction
Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter
Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator
设计资源: Low Jitter Sampling Clock Generator for High Performance ADCs Using AD9958/9858 and AD9515 (CN0109)
标准包装: 1
分辨率(位): 10 b
主 fclk: 1GHz
调节字宽(位): 32 b
电源电压: 3.14 V ~ 3.47 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 100-TQFP 裸露焊盘
供应商设备封装: 100-TQFP-EP(14x14)
包装: 托盘
产品目录页面: 552 (CN2011-ZH PDF)
AD9858
Rev. C | Page 29 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
02
18
09
-A
1
25
26
50
76
100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
26
50
76
100
75
51
6.50
NOM
3.5°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
PIN 1
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 40. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
WARNING
The TQFP_EP (thermal slug) must be attached to the ground plane or some other large metal mass for thermal transfer. Failure to do so
may cause excessive die temperature rise and damage to the device.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD9858BSV
–40°C to +85°C
100-Lead TQFP_EP
SV-100-1
AD9858BSVZ1
–40°C to +85°C
100-Lead TQFP_EP
SV-100-1
Generic Evaluation Board
AD9858/FDPCB
Fractional Divide Evaluation Board
AD9858/TLPCBZ1
Translation Loop Evaluation Board
1 Z = RoHS Compliant Part.
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