- 您现在的位置：买卖IC网 > PDF目录16543 > ADA4856-3YCP-EBZ (Analog Devices Inc)BOARD EVAL FOR ADA4856-3YCP PDF资料下载
参数资料
| 型号： | ADA4856-3YCP-EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADA4856-3YCP |
| 标准包装： | 1 |
| 系列： | * |
Data Sheet
ADA4856-3
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
6 V
Internal Power Dissipation1
Common-Mode Input Voltage
(VS 0.2 V) to (+VS 1 V)
Differential Input Voltage
±VS
Output Short-Circuit Duration
Observe power curves
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +105°C
Lead Temperature (Soldering, 10 sec)
300°C
1
Specification is for device in free air.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for a device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
θJA
θJC
Unit
16-Lead LFCSP
67
17.5
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4856-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
3.0
2.5
2.0
1.5
1.0
0.5
0
07686-
103
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
AMBIENT TEMPERATURE (°C)
–40
–30
–20
–10
10
20
30
40
50
60
70
80
90
100
0
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
相关PDF资料 |
PDF描述 |
|---|---|
| H3BBS-4018M | IDC CABLE - HSR40S/AE40M/HSR40S |
| 5503995-3 | CABLE ASSEM FIBER ST-ST 3 METER |
| ADA4859-3ACP-EBZ | BOARD EVAL FOR ADA4859-3ACP |
| AD8280-EVALZ | BOARD EVAL FOR AD8280 |
| ECE-T2WP681EA | CAP ALUM 680UF 450V 20% SNAP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4856-3YCPZ-R2 | 功能描述:IC AMP 3CH RRO VFB G=+2 16LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
| ADA4856-3YCPZ-R7 | 功能描述:IC AMP 3CH RRO VFB G=2 16LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| ADA4856-3YCPZ-RL | 功能描述:IC AMP 3CH RRO VFB G=+2 16LFCSP RoHS:是 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 标准包装:1,000 系列:- 应用:驱动器 输出类型:差分 电路数:3 -3db带宽:350MHz 转换速率:1000 V/µs 电流 - 电源:14.5mA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):5 V ~ 12 V，±2.5 V ~ 6 V 安装类型:表面贴装 封装/外壳:20-VFQFN 裸露焊盘 供应商设备封装:20-QFN 裸露焊盘（4x4） 包装:带卷 (TR) |
| ADA4857-1 | 制造商:AD 制造商全称:Analog Devices 功能描述:Ultralow Distortion, Low Power, Low Noise, High Speed Op Amp |
| ADA4857-1ACP-EBZ | 功能描述:BOARD EVAL FOR ADA4857-1ACP RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
发布紧急采购，3分钟左右您将得到回复。