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| 型号： | ADA4857-1ACP-EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 10/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADA4857-1ACP |
| 标准包装： | 1 |
| 每 IC 通道数： | 1 - 单 |
| 放大器类型： | 电压反馈 |
| 板类型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 8-LFCSP 封装 |
ADA4857-1/ADA4857-2
Data Sheet
Rev. C | Page 18 of 20
NOISE
To analyze the noise performance of an amplifier circuit, identify
the noise sources and determine if the source has a significant
contribution to the overall noise performance of the amplifier.
To simplify the noise calculations, noise spectral densities were
used rather than actual voltages to leave bandwidth out of the
expressions (noise spectral density, which is generally expressed
in nV/√Hz, is equivalent to the noise in a 1 Hz bandwidth).
The noise model shown in Figure 50 has six individual noise
sources: the Johnson noise of the three resistors, the op amp
voltage noise, and the current noise in each input of the amplifier.
Each noise source has its own contribution to the noise at the
output. Noise is generally referred to input (RTI), but it is often
easier to calculate the noise referred to the output (RTO) and
then divide by the noise gain to obtain the RTI noise.
GAIN FROM
B TO OUTPUT
= –
R2
R1
GAIN FROM
A TO OUTPUT
=
NOISE GAIN =
NG = 1 +
IN–
VN
VN, R1
VN, R3
R1
R2
IN+
R3
4kTR2
4kTR1
4kTR3
VN, R2
B
A
VN2 + 4kTR3 + 4kTR1
R2
2
R1 + R2
IN+2R32 + IN–2
R1 × R2
2
+ 4kTR2
R1
2
R1 + R2
RTI NOISE =
RTO NOISE = NG × RTI NOISE
VOUT
+
07040-
073
R2
R1
Figure 50. Op Amp Noise Analysis Model
All resistors have Johnson noise that is calculated by
)
(4kBTR
where:
k is Boltzmann’s Constant (1.38 × 10–23 J/K).
B is the bandwidth in Hertz.
T is the absolute temperature in Kelvin.
R is the resistance in ohms.
A simple relationship that is easy to remember is that a 50
resistor generates a Johnson noise of 1 nV/√Hz at 25°C.
In applications where noise sensitivity is critical, care must
be taken not to introduce other significant noise sources to
the amplifier. Each resistor is a noise source. Attention to the
following areas is critical to maintain low noise performance:
design, layout, and component selection. A summary of noise
performance for the amplifier and associated resistors can be
seen in Table 9.
CIRCUIT CONSIDERATIONS
Careful and deliberate attention to detail when laying out the
ADA4857 board yields optimal performance. Power supply
bypassing, parasitic capacitance, and component selection all
contribute to the overall performance of the amplifier.
PCB LAYOUT
Because the ADA4857 can operate up to 850 MHz, it is essential
that RF board layout techniques be employed. All ground and
power planes under the pins of the ADA4857 should be cleared
of copper to prevent the formation of parasitic capacitance between
the input pins to ground and the output pins to ground. A single
mounting pad on the SOIC footprint can add as much as 0.2 pF
of capacitance to ground if the ground plane is not cleared from
under the mounting pads. The low distortion pinout of the
ADA4857 increases the separation distance between the inputs
and the supply pins, which improves the second harmonics. In
addition, the feedback pin reduces the distance between the output
and the inverting input of the amplifier, which helps minimize
the parasitic inductance and capacitance of the feedback path,
reducing ringing and peaking.
POWER SUPPLY BYPASSING
Power supply bypassing for the ADA4857 was optimized for
frequency response and distortion performance. Figure 42 shows
the recommended values and location of the bypass capacitors.
The 0.1 F bypassing capacitors should be placed as close as
possible to the supply pins. Power supply bypassing is critical for
stability, frequency response, distortion, and PSR performance.
The capacitor between the two supplies helps improve PSR and
distortion performance. The 10 F electrolytic capacitors should
be close to the 0.1 F capacitors; however, it is not as critical. In
some cases, additional paralleled capacitors can help improve
frequency and transient response.
GROUNDING
Ground and power planes should be used where possible. Ground
and power planes reduce the resistance and inductance of the
power planes and ground returns. The returns for the input, output
terminations, bypass capacitors, and RG should all be kept as
close to the ADA4857 as possible. The output load ground and the
bypass capacitor grounds should be returned to the same point
on the ground plane to minimize parasitic trace inductance,
ringing, and overshoot and to improve distortion performance.
The ADA4857 LFSCP packages feature an exposed paddle. For
optimum electrical and thermal performance, solder this paddle to
the ground plane or the power plane. For more information on
high speed circuit design, see A Practical Guide to High-Speed
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