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参数资料
| 型号： | ADA4932-1YCP-EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 18/29页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADA4932-1YCP |
| 标准包装： | 1 |
| 每 IC 通道数： | 1 - 单 |
| 放大器类型： | 差分 |
| 板类型： | 裸（未填充） |
| 已供物品： | 板 |
| 已用 IC / 零件： | 16-LFCSP 封装 |
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ADA4932-1/ADA4932-2
Data Sheet
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4932-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as much
of the board area around the ADA4932-x as possible. However,
the area near the feedback resistors (RF), gain resistors (RG), and
the input summing nodes (Pin 2 and Pin 3) should be cleared of
all ground and power planes (see Figure 64). Clearing the ground
and power planes minimizes any stray capacitance at these nodes
and thus minimizes peaking of the response of the amplifier at
high frequencies.
The thermal resistance, θJA, is specified for the device, including
the exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
07752-
055
Figure 64. Ground and Power Plane Voiding in Vicinity of RF and RG
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. High frequency ceramic
chip capacitors should be used. It is recommended that two
parallel bypass capacitors (1000 pF and 0.1 F) be used for each
supply. Place the 1000 pF capacitor closer to the device. Further
away, provide low frequency bulk bypassing using 10 F tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic effects.
Wherever complementary signals exist, provide a symmetrical
layout to maximize balanced performance. When routing
differential signals over a long distance, keep PCB traces close
together, and twist any differential wiring to minimize loop
area. Doing this reduces radiated energy and makes the circuit
less susceptible to interference.
1.30
0.80
1.30
07752-
056
Figure 65. Recommended PCB Thermal Attach Pad Dimensions (Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07752-
057
Figure 66. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
Rev. C | Page 24 of 28
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4932-1YCPZ-R2 | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Single 制造商:Analog Devices 功能描述:LW CST/LW PWR DIFF ADC DRIVER - Tape and Reel 制造商:Analog Devices 功能描述:ANAADA4932-1YCPZ-R2 LW CST/LW PWR DIFF A 制造商:Analog Devices 功能描述:AMP DIFF LP 80MA 16LFCSP 制造商:Analog Devices 功能描述:AMP, DIFF, LP, 80MA, 16LFCSP 制造商:Analog Devices 功能描述:AMP, DIFF, LP, 80MA, 16LFCSP; No. of Amplifiers:1; Input Offset Voltage:2.2mV; Bandwidth:560MHz; Amplifier Case Style:LFCSP; No. of Pins:16; Supply Voltage Range:3V to 11V; Slew Rate:2800V/s; Supply Current:9.6mA; Operating ;RoHS Compliant: Yes 制造商:Analog Devices 功能描述:SP Amp Diff ADC Driver Single 5.5V/11V |
| ADA4932-1YCPZ-R2 | 制造商:Analog Devices 功能描述:IC DIFF AMP 560MHZ 2800V/ LFCSP-16 |
| ADA4932-1YCPZ-R21 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Power Differential ADC Driver |
| ADA4932-1YCPZ-R7 | 功能描述:IC AMP DIFF LP 80MA 16LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 产品培训模块:Differential Circuit Design Techniques for Communication Applications 标准包装:1 系列:- 放大器类型:RF/IF 差分 电路数:1 输出类型:差分 转换速率:9800 V/µs 增益带宽积:- -3db带宽:2.9GHz 电流 - 输入偏压:3µA 电压 - 输入偏移:- 电流 - 电源:40mA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-VQFN 裸露焊盘，CSP 供应商设备封装:16-LFCSP-VQ 包装:剪切带 (CT) 产品目录页面:551 (CN2011-ZH PDF) 其它名称:ADL5561ACPZ-R7CT |
| ADA4932-1YCPZ-R71 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Power Differential ADC Driver |
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