- 您现在的位置：买卖IC网 > PDF目录2139 > ADA4950-1YCPZ-RL (Analog Devices Inc)IC AMP DIFF LP 114MA 16LFCSP PDF资料下载
参数资料
| 型号： | ADA4950-1YCPZ-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/28页 |
| 文件大小： | 0K |
| 描述： | IC AMP DIFF LP 114MA 16LFCSP |
| 标准包装： | 5,000 |
| 放大器类型： | 差分 |
| 电路数： | 1 |
| 输出类型： | 差分 |
| 转换速率： | 2900 V/µs |
| -3db带宽： | 750MHz |
| 电压 - 输入偏移： | 200µV |
| 电流 - 电源： | 9.5mA |
| 电流 - 输出 / 通道： | 114mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 11 V，±1.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 带卷 (TR) |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页当前第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页
Data Sheet
ADA4950-1/ADA4950-2
Rev. A | Page 23 of 28
LAYOUT, GROUNDING, AND BYPASSING
As a high speed device, the ADA4950-x is sensitive to the
PCB environment in which it operates. Realizing its superior
performance requires attention to the details of high speed
PCB design.
The first requirement is a solid ground plane that covers as
much of the board area around the ADA4950-x as possible. The
thermal resistance, θJA, is specified for the device, including the
exposed pad, soldered to a high thermal conductivity 4-layer
circuit board, as described in EIA/JESD51-7.
Bypass the power supply pins as close to the device as possible
and directly to a nearby ground plane. Use high frequency
ceramic chip capacitors. It is recommended that two parallel
bypass capacitors (1000 pF and 0.1 μF) be used for each supply.
Place the 1000 pF capacitor closer to the device. Farther away,
provide low frequency bulk bypassing using 10 μF tantalum
capacitors from each supply to ground.
Signal routing should be short and direct to avoid parasitic
effects. Wherever complementary signals exist, provide a
symmetrical layout to maximize balanced performance. When
routing differential signals over a long distance, keep PCB
traces close together, and twist any differential wiring to
minimize loop area. Doing this reduces radiated energy and
makes the circuit less susceptible to interference.
1.30
0.80
1.30
07
95
7-
0
56
Figure 61. Recommended PCB Thermal Attach Pad (Dimensions in Millimeters)
0.30
PLATED
VIA HOLE
1.30
GROUND PLANE
POWER PLANE
BOTTOM METAL
TOP METAL
07
95
7-
05
7
Figure 62. Cross-Section of 4-Layer PCB Showing Thermal Via Connection to Buried Ground Plane (Dimensions in Millimeters)
相关PDF资料 |
PDF描述 |
|---|---|
| ADEL2020ARZ-20-RL | IC OPAMP CF LN LP 60MA 20SOIC |
| ADL5561ACPZ-R7 | IC AMP DIFF RF/IF 2.9GHZ 16LFCSP |
| ADL5562ACPZ-R7 | IC AMP DIFF RF/IF 3.3GHZ 16LFCSP |
| ADL5565ACPZ-R7 | IC AMP DIFF 6GHZ 16LFCSP |
| ADM4073TWRJZ-REEL7 | IC AMP CS 1.8MHZ SOT23-6 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ADA4950-2 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Power, Selectable Gain Differential ADC Driver, G = 1, 2, 3 |
| ADA4950-2YCP-EBZ | 功能描述:BOARD EVAL FOR ADA4950-2YCP RoHS:是 类别:编程器，开发系统 >> 评估板 - 运算放大器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- |
| ADA4950-2YCPZ-R2 | 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Dual 制造商:Analog Devices 功能描述:FIXED GAIN 1,2&3 DIFF ADC DRIVER - Tape and Reel 制造商:Analog Devices 功能描述:SP Amp DIFF AMP Dual }5.5V/11V 24-Pin LFCSP EP |
| ADA4950-2YCPZ-R7 | 功能描述:IC AMP DIFF DUAL 114MA 24LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:2,500 系列:- 放大器类型:通用 电路数:4 输出类型:- 转换速率:0.6 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:45nA 电压 - 输入偏移:2000µV 电流 - 电源:1.4mA 电流 - 输出 / 通道:40mA 电压 - 电源，单路/双路(±):3 V ~ 32 V，±1.5 V ~ 16 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:带卷 (TR) 其它名称:LM324ADTBR2G-NDLM324ADTBR2GOSTR |
| ADA4950-2YCPZ-RL | 功能描述:IC AMP DIFF DUAL 114MA 24LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:150 系列:- 放大器类型:音频 电路数:2 输出类型:- 转换速率:5 V/µs 增益带宽积:12MHz -3db带宽:- 电流 - 输入偏压:100nA 电压 - 输入偏移:500µV 电流 - 电源:6mA 电流 - 输出 / 通道:50mA 电压 - 电源，单路/双路(±):4 V ~ 32 V，±2 V ~ 16 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:8-TSSOP 包装:管件 |
发布紧急采购，3分钟左右您将得到回复。