参数资料
型号: ADD5205ACPZ-RL
厂商: Analog Devices Inc
文件页数: 12/16页
文件大小: 0K
描述: IC LED DVR WHITE BCKLGT 12LFCSP
标准包装: 1
恒定电流:
拓扑: PWM,升压(升压)
输出数: 4
内部驱动器:
类型 - 主要: 背光
类型 - 次要: 白色 LED
频率: 1MHz
电源电压: 2.8 V ~ 18 V
安装类型: 表面贴装
封装/外壳: 12-WFQFN 裸露焊盘,CSP
供应商设备封装: 12-LFCSP-WQ(3x3)
包装: 标准包装
工作温度: -25°C ~ 85°C
其它名称: ADD5205ACPZ-RLDKR
ADD5205
LAYOUT GUIDELINES
When designing a high frequency, switching, regulated power
Data Sheet
Layout Procedure
Use the following general guidelines when designing PCBs:
supply, layout is very important. Using a good layout can solve
many problems associated with these types of supplies. The main
problems are loss of regulation at high output current and/or
large input-to-output voltage differentials, excessive noise on
the output and switch waveforms, and instability. Using the
following guidelines can help minimize these problems.
Make all power (high current) traces as short, direct, and thick
as possible. It is good practice on a standard printed circuit
board (PCB) to make the traces an absolute minimum of 15 mil
(0.381 mm) per ampere. Place the inductor, output capacitors,
and output diode as close to each other as possible. This helps
reduce the EMI radiated by the power traces that is due to the
high switching currents through them. This also reduces lead
inductance and resistance, which in turn reduces noise spikes,
ringing, and resistive losses that produce voltage errors.
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Keep C IN close to the VIN and GND leads of the ADD5205 .
Keep the high current path from C IN (through L1) to the
SW and GND leads as short as possible.
Keep the high current path from C IN (through L1), D1, and
C OUT as short as possible.
Keep high current traces as short and wide as possible.
Place the C OVP as close as possible to the OVP pin.
Place the LED current setting resistors as close as possible
to each pin to prevent noise pickup.
Avoid routing noise sensitive traces near high current
traces and components, especially the LED current setting
node (ISET).
Use a thermal pad size that is the same dimension as the
exposed pad on the bottom of the package.
The grounds of the IC, input capacitors, output capacitors, and
output diode (if applicable), should be connected close together,
directly to a ground plane. It is also a good idea to have a ground
plane on both sides of the PCB. This reduces noise by reducing
ground loop errors and by absorbing more of the EMI radiated
by the inductor.
Heat Sinking
When using a surface-mount power IC or external power
switches, the PCB can often be used as the heat sink. This is
done by using the copper area of the PCB to transfer heat from
the device. Users should maximize this area to optimize thermal
performance.
Due to how switching regulators operate, there are two power
states: on and off. During each state, there is a current loop made
by the power components currently conducting. Place the power
components so that the current loop is conducting in the same
direction during each of the two states. This prevents magnetic
field reversal caused by the traces between the two half cycles
and reduces radiated EMI.
Rev. 0 | Page 12 of 16
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