参数资料
型号: ADG1414BRUZ
厂商: Analog Devices Inc
文件页数: 2/20页
文件大小: 0K
描述: IC SW SPST 9.5OHM RON 24TSSOP
标准包装: 62
系列: iCMOS®
功能: 开关
电路: 8 x SPST - NO
导通状态电阻: 21.5 欧姆
电压电源: 单/双电源
电压 - 电源,单路/双路(±): 4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V
电流 - 电源: 1nA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 24-TSSOP
包装: 管件
产品目录页面: 801 (CN2011-ZH PDF)
ADG1414
Data Sheet
Rev. A | Page 10 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 7.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VL to GND
0.3 V to +7 V
Analog Inputs1
VSS 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1
GND 0.3 V to VL + 0.3 V or
30 mA, whichever occurs first
Continuous Current, Sx or Dx
Pins
Table 4 specifications + 15%
Peak Current, Sx or Dx (Pulsed
at 1 ms, 10% Duty Cycle Max)
TSSOP Package
300 mA
LFCSP Package
400 mA
Operating Temperature Range
Industrial (B Version)
–40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature, Pb free
260°C
Time at Peak Temperature
10 sec to 40 sec
1
Overvoltages at the analog and digital inputs are clamped by internal
diodes. Limit the current to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
THERMAL RESISTANCE
Table 8. Thermal Resistance
Package Type
θJA
θJC
Unit
24-Lead TSSOP1
112.6
50
°C/W
24-Lead LFCSP2
30.4
°C/W
1
4-layer board.
2
4-layer board and exposed paddle soldered to VSS.
ESD CAUTION
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