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| 型号： | ADG417BRZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 4/8页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPST 8SOIC |
| 产品培训模块： | Switch Fundamentals |
| 标准包装： | 98 |
| 系列： | LC²MOS |
| 功能： | 开关 |
| 电路： | 1 x SPST- NC |
| 导通状态电阻： | 40 欧姆 |
| 电压电源： | 单/双电源 |
| 电压 - 电源，单路/双路(±)： | 12V，±15V |
| 电流 - 电源： | 100pA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 800 (CN2011-ZH PDF) |
REV. A
–4–
ADG417
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25
°C unless otherwise noted)
VDD to VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
VL to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Analog, Digital Inputs
2
. . . . . . . . . . . . . VSS – 2 V to VDD +2 V
or 30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 400 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 100
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 400 mW
θ
JA, Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 155
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec). . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
VD (VS)
Analog voltage on terminals D, S.
CS (OFF)
“OFF” switch source capacitance.
CD (OFF)
“OFF” switch drain capacitance.
CD, CS (ON)
“ON” switch capacitance.
tON
Delay between applying the digital control
input and the output switching on.
tOFF
Delay between applying the digital control
input and the output switching off.
VINL
Maximum input voltage for logic “0.”
VINH
Minimum input voltage for logic “1.”
IINL (IINH)
Input current of the digital input.
Charge Injection
A measure of the glitch impulse transferred
from the digital input to the analog output
during switching.
Off Isolation
A measure of unwanted signal coupling
through an “OFF” channel.
IDD
Positive supply current.
ISS
Negative supply current.
IL
Logic supply current.
TERMINOLOGY
VDD
Most positive power supply potential.
VSS
Most negative power supply potential in dual
supplies. In single supply applications, it
may be connected to GND.
VL
Logic power supply (+5 V).
GND
Ground (0 V) reference.
S
Source terminal. May be an input or an
output.
D
Drain terminal. May be an input or an
output.
IN
Logic control input.
RON
Ohmic resistance between D and S.
IS (OFF)
Source leakage current with the switch
“OFF.”
ID (OFF)
Drain leakage current with the switch
“OFF.”
ID, IS (ON)
Channel leakage current with the switch
“ON.”
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG417 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADG417BRZ | 制造商:Analog Devices 功能描述:Analog Switch / Multiplexer (Mux) IC |
| ADG417BRZ-REEL | 功能描述:IC SWITCH SPST 8SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:LC²MOS 标准包装:1,000 系列:- 功能:多路复用器 电路:1 x 4:1 导通状态电阻:- 电压电源:双电源 电压 - 电源，单路/双路(±):±5V 电流 - 电源:7mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| ADG419 | 制造商:AD 制造商全称:Analog Devices 功能描述:LC2MOS Precision Mini-DIP Analog Switch |
| ADG419_09 | 制造商:AD 制造商全称:Analog Devices 功能描述:LC2MOS Precision Mini-DIP Analog Switch |
| ADG419BN | 功能描述:IC SWITCH SPDT 8DIP RoHS:否 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:LC²MOS 标准包装:48 系列:- 功能:开关 电路:4 x SPST - NO 导通状态电阻:100 欧姆 电压电源:单/双电源 电压 - 电源，单路/双路(±):2 V ~ 12 V，±2 V ~ 6 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC 包装:管件 |
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