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参数资料
| 型号： | ADG819BRTZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 7/12页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPDT SOT23-6 |
| 产品培训模块： | Switch Fundamentals |
| 标准包装： | 3,000 |
| 功能： | 开关 |
| 电路： | 1 x SPDT - NC/NO |
| 导通状态电阻： | 600 毫欧 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V |
| 电流 - 电源： | 1nA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-23-6 |
| 包装： | 带卷 (TR) |
ADG819/ADG820
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Inputs
2 . . . . . . . . . . . . . . . . . –0.3 V to V
DD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Digital Inputs
2 . . . . . . . . . . . . . . . . . –0.3 V to V
DD + 0.3 V or
. . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
. . . . . . . . . . . . . . . .(Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
SOIC Package
!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
!
JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44
°C/W
SOT-23 Package (4-Layer Board)
!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119°C/W
MicroCSP Package
!JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235
°C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Table I. Truth Table for the ADG819/ADG820
IN
Switch S1
Switch S2
0
ON
OFF
1
OFF
ON
PIN CONFIGURATIONS
6-Lead SOT-23
8-Lead
SOIC
(RJ-6)
(RM-8)
TOP VIEW
(Not to Scale)
6
2
ADG820
5
4
1
3
ADG819/
S2
D
IN
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
ADG819/
ADG820
S2
NC
D
S1
IN
VDD
GND
VDD
S1
GND
NC
NC = NO CONNECT
ORDERING GUIDE
Model Option
Temperature Range
Brand
1
Package Description
Package
ADG819BRM
ADG819BRT
ADG819BCB
ADG820BRM
ADG820BRT
–40
°C to +125°C
–40
°C to +125°C
–40
°C to +85°C
–40
°C to +125°C
–40
°C to +125°C
SNB
SPB
SOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
MicroCSP (Micro Chip Scale Package)
SOIC (MicroSmall Outline IC)
SOT-23 (Plastic Surface-Mount)
RM-8
RJ-6
2
CB-62
RM-8
RJ-6
2
NOTES
1Branding on these packages is limited to three characters due to space constraints.
2Contact factory for availability.
2
X 3 MicroCSP
TOP VIEW
(BUMPS AT THE BOTTOM)
NOT TO SCALE
S2
1
IN
6
D
2
VDD
5
S1
3
GND
4
ADG819 ONLY
–4–
REV. 0
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