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参数资料
| 型号： | ADN2531ACPZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC LASER DRIVER 11.3GBPS 16LFCSP |
| 标准包装： | 1,500 |
| 类型： | 激光二极管驱动器 |
| 数据速率： | 11.3Gbps |
| 通道数： | 1 |
| 电源电压： | 3 V ~ 3.6 V |
| 电流 - 电源： | 36mA |
| 电流 - 调制： | 80mA |
| 电流 - 偏置： | 100mA |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 带卷 (TR) |
| 安装类型： | 表面贴装 |
P = V CC × ? MSET + I SUPPLY ? + V IBIAS × ?
? V ? ? V BSET ?
THERMAL COMPOUND
ADN2531
LOAD MISTERMINATION
Due to its excellent S22 performance, the ADN2531 can drive
differential loads that range from 5 ? to 140 ?. In practice, many
TOSAs have differential resistance not equal to 100 ?. In this
case, with 100 ? differential transmission lines connecting the
ADN2531 to the load, the load end of the transmission lines are
misterminated. This mistermination leads to signal reflections
back to the driver. The excellent back-termination in the ADN2531
absorbs these reflections, preventing their reflection back to the
load. This enables excellent optical eye quality to be achieved even
when the load end of the transmission lines is significantly mis-
terminated. The connection between the load and the ADN2531
must be made with 100 ? differential (50 ? single-ended)
Data Sheet
Considering V BSET /I BIAS = 10 V/A as the conversion factor from
V BSET to IBIAS, the dissipated power becomes
?
? 5 . 8 ? ? 10 V / A ?
To ensure long-term reliable operation, the ADN2531 junction
temperature must not exceed 150°C, as specified in Table 3. For
improved heat dissipation, the module case can be used as a
MODULE CASE
T TOP
transmission lines so that the driver end of the transmission
lines is properly terminated.
DIE
PACKAGE
T J
THERMOCOUPLES
θ J ? PAD + θ J ? TOP
CROSSPOINT ADJUST
The crossing level in the output electrical eye diagram can be
adjusted between 35% and 65% using the crosspoint adjust (CPA)
control input. This can be used to compensate for asymmetry in
the laser response and to optimize the optical eye mask margin.
The CPA input is a voltage-control input, and a plot of eye cross-
in the Typical Performance Characteristics section. The equivalent
circuit for the CPA pin is shown in Figure 37. To disable the
crosspoint adjust function and set the eye crossing to 50%, the
CPA pin should be tied to V CC .
T PAD
PCB
COPPER PLANE
VIAS
Figure 38. Typical Optical Module Structure
A compact optical module is a complex thermal environment, and
calculations of device junction temperature using the junction-to-
ambient thermal resistance (θ JA ) of the package do not yield
accurate results. The following equation, derived from the
model in Figure 39, can be used to estimate the IC junction
temperature:
P × ( θ J ? PAD × θ J ? TOP ) + T TOP × θ J ? PAD + T PAD × θ J ? TOP
T J =
7k?
V CC
7k?
7k?
where:
T TOP is the temperature at the top of the package in °C.
T PAD is the temperature at the package exposed paddle in °C.
T J is the IC junction temperature in °C.
P is the ADN2531 power dissipation in watts.
CPA
Figure 37. Equivalent Circuit for CPA Pin
POWER CONSUMPTION
The power dissipated by the ADN2531 is given by
θ J-TOP is the thermal resistance from the IC junction to the top of
the package.
θ J-PAD is the thermal resistance from the IC junction to the
exposed paddle of the package.
T TOP
× ? MSET + I SUPPLY ? + V IBIAS × I BIAS
P = V CC
? V ?
? 5 . 8 ?
θ J-TOP
T TOP
where:
V CC is the power supply voltage.
P
T J
θ J-PAD
T PAD
V MSET is the voltage applied to the MSET pin.
I SUPPLY is the sum of the current that flows into the VCC, IMODP,
V IBIAS is the average voltage on the IBIAS pin.
T PAD
Figure 39. Electrical Model for Thermal Calculations
T TOP and T PAD can be determined by measuring the temperature
at points inside the module, as shown in Figure 38. The thermo-
couples should be positioned to obtain an accurate measurement of
the temperatures of the package top and paddle. θ J-TOP and θ J-PAD
Rev. A | Page 14 of 20
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