参数资料
型号: ADN2531ACPZ-R7
厂商: Analog Devices Inc
文件页数: 4/20页
文件大小: 0K
描述: IC LASER DRIVER 11.3GBPS 16LFCSP
标准包装: 1,500
类型: 激光二极管驱动器
数据速率: 11.3Gbps
通道数: 1
电源电压: 3 V ~ 3.6 V
电流 - 电源: 36mA
电流 - 调制: 80mA
电流 - 偏置: 100mA
工作温度: -40°C ~ 100°C
封装/外壳: 16-VFQFN 裸露焊盘,CSP
供应商设备封装: 16-LFCSP-VQ
包装: 带卷 (TR)
安装类型: 表面贴装
ADN2531
Data Sheet
Parameter
Min
Typ
Max
Unit
Test Conditions/Comments
POWER SUPPLY
V CC
I CC8
3.0
3.3
36
3.6
V
mA
V BSET = V MSET = 0 V
I SUPPLY9
55
62
mA
V BSET = V MSET = 0 V
1
2
3
4
5
6
7
8
9
The voltage between the pin with the specified compliance voltage and GND.
Specified for T A = ?40°C to +85°C due to test equipment limitation. See the Typical Performance Characteristics section for data on performance for T A = ?40°C to +100°C.
The pattern used is composed of a repetitive sequence of eight 1s followed by eight 0s at 10.7 Gbps.
Measured using the high speed characterization circuit shown in Figure 22.
The pattern used is K28.5 (00111110101100000101) at 10.7 Gbps rate.
The pattern used is K28.5 (00111110101100000101) at 11.3 Gbps rate.
Measured at balanced IMODP and IMODN.
Only includes current in the ADN2531 VCC pins.
Includes current in ADN2531 VCC pins and dc current in IMODP and IMODN pull-up inductors. See the Power Consumption section for total supply current calculation.
PACKAGE THERMAL SPECIFICATIONS
Table 2.
Parameter
θ J-TOP
θ J-PAD
Min
65
2.6
Typ
72.2
5.8
Max
79.4
10.7
Unit
°C/W
°C/W
Test Conditions/Comments
Thermal resistance from junction to top of package.
Thermal resistance from junction to bottom of exposed pad.
IC Junction Temperature
ALS
125
°C
ALS
NEGATE TIME
t
I BIAS
AND I MOD
90%
10%
ALS
ASSERT TIME
Figure 2. ALS Timing Diagram
Rev. A | Page 4 of 20
t
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