参数资料
| 型号： | ADN2890ACPZ-RL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 2/12页 |
| 文件大小： | 0K |
| 描述： | IC AMP LIM 16LFCSP |
| 标准包装： | 1 |
| 放大器类型： | 限制 |
| 电路数： | 1 |
| 输出类型： | 差分 |
| 电压 - 输入偏移： | 100µV |
| 电流 - 电源： | 39mA |
| 电压 - 电源，单路/双路(±)： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 标准包装 |
| 产品目录页面： | 788 (CN2011-ZH PDF) |
| 其它名称： | ADN2890ACPZ-RL7DKR |
ADN2890
Data Sheet
Rev. A | Page 10 of 12
PCB Layout
Figure 9 shows a recommended PC board layout. Use of 50
transmission lines is required for all high frequency input and
output signals to minimize reflections: PIN, NIN, OUTP and
OUTN. It is also necessary for the PIN/NIN input traces to be
matched in length, and OUTP/OUTN output traces to be matched
in length to avoid skew between the differential traces. C1, C2,
C3, and C4 are ac-coupling capacitors in series with the high
speed I/O. It is recommended that components be used such
that the pad for the capacitor is the same width as the transmission
line in order to minimize the mismatch in the 50 transmission
line at the capacitor’s pads. It is recommended that the trans-
mission lines not change layers through vias, if possible. For
supply decoupling, the 1 nF decoupling capacitor should be
placed on the same layer as the ADN2890 as close as possible to
the VCC pin. The 0.1 F capacitor can be placed on the bottom
of the PCB directly underneath the 1 nF decoupling capacitor.
All high speed CML outputs are back-terminated on chip with
50 resistors connected between the output pin and VCC. The
high speed inputs, PIN and NIN, are internally terminated with
50 to an internal reference voltage.
As with any high speed mixed-signal design, take care to keep
all high speed digital traces away from sensitive analog nodes.
Soldering Guidelines for Chip Scale Package
The lands on the 16 LFCSP are rectangular. The printed circuit
board pad for these should be 0.1 mm longer than the package
land length and 0.05 mm wider than the package land width.
The land should be centered on the pad. This ensures that the
solder joint size is maximized. The bottom of the chip scale
package has a central exposed pad. The pad on the printed
circuit board should be at least as large as this exposed pad. The
user must connect the exposed pad to VEE using filled vias so
that solder does not leak through the vias during reflow. This
ensures a solid connection from the exposed pad to VEE.
Figure 9. Recommended ADN2890 PCB Layout
04509-0-008
1
VIAS TO
GND
EXPOSED PAD
PIN
NIN
VIA TO C12, R2
ON BOTTOM
C11
VIA TO BOTTOM
DOUBLE-VIA TO GND
TO REDUCE INDUCTANCE
C3
C8
C4
C1
C6
C2
OUTP
DOUBLE-VIAS TO REDUCE
INDUCTANCE TO SUPPLY
AND GND
R1, C9, C10 ON BOTTOM
TO ROSA
PLACE C7 ON
BOTTOM OF BOARD
UNDERNEATH C8
OUTN
PLACE C5 ON
BOTTOM OF BOARD
UNDERNEATH C6
4mm
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| ADN2891ACPZ-500RL7 | 功能描述:IC AMP LIM 16LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:1 系列:MicroAmplifier™ 放大器类型:通用 电路数:4 输出类型:- 转换速率:3.5 V/µs 增益带宽积:1MHz -3db带宽:- 电流 - 输入偏压:5pA 电压 - 输入偏移:1500µV 电流 - 电源:220µA 电流 - 输出 / 通道:60mA 电压 - 电源，单路/双路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-SOIC（0.154"，3.90mm 宽） 供应商设备封装:14-SOIC 包装:剪切带 (CT) 其它名称:296-29363-1 |
| ADN2891ACPZ-RL | 功能描述:IC AMP LIM 16LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:50 系列:- 放大器类型:J-FET 电路数:2 输出类型:- 转换速率:13 V/µs 增益带宽积:3MHz -3db带宽:- 电流 - 输入偏压:65pA 电压 - 输入偏移:3000µV 电流 - 电源:1.4mA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作温度:-40°C ~ 85°C 安装类型:通孔 封装/外壳:8-DIP（0.300"，7.62mm） 供应商设备封装:8-PDIP 包装:管件 |
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