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参数资料
| 型号： | ADN4692EBRZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 9/20页 |
| 文件大小： | 0K |
| 描述： | IC INTERFACE TXRX |
| 标准包装： | 56 |
| 系列： | * |
Data Sheet
ADN4690E/ADN4692E
Rev. 0 | Page 17 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AA
01240
7-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 38. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
06
060
6-
A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
8°
0°
45°
Figure 39. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Temperature Range
Package Description
Package Option
ADN4690EBRZ
–40°C to +85°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
ADN4690EBRZ-RL7
–40°C to +85°C
8-Lead Standard Small Outline Package (SOIC_N)
R-8
ADN4692EBRZ
–40°C to +85°C
14-Lead Standard Small Outline Package (SOIC_N)
R-14
ADN4692EBRZ-RL7
–40°C to +85°C
14-Lead Standard Small Outline Package (SOIC_N)
R-14
EVAL-ADN469xEHDEBZ
Evaluation Board for Half-Duplex M-LVDS (ADN4690E)
EVAL-ADN469xEFDEBZ
Evaluation Board for Full-Duplex M-LVDS (ADN4692E)
1 Z = RoHS Compliant Part.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADN4692EBRZ-RL7 | 功能描述:IC TXRX MLVDS 100MBPS 8SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:* 标准包装:121 系列:- 类型:收发器 驱动器/接收器数:1/1 规程:RS422，RS485 电源电压:3 V ~ 3.6 V 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-DFN（3x3） 包装:管件 |
| ADN4693E | 制造商:AD 制造商全称:Analog Devices 功能描述:3.3 V, 100 Mbps, Half- and Full-Duplex |
| ADN4693EBRZ | 功能描述:IC M-LVDS TRANSCEIVER RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:* 产品培训模块:RS-232 & USB Transceiver 标准包装:2,000 系列:- 类型:收发器 驱动器/接收器数:1/1 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SSOP（0.209"，5.30mm 宽） 供应商设备封装:16-SSOP 包装:带卷 (TR) 其它名称:296-19849-2 |
| ADN4693EBRZ-RL7 | 功能描述:IC TXRX MLVDS 200MBPS 14SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:* 标准包装:121 系列:- 类型:收发器 驱动器/接收器数:1/1 规程:RS422，RS485 电源电压:3 V ~ 3.6 V 安装类型:表面贴装 封装/外壳:10-WFDFN 裸露焊盘 供应商设备封装:10-DFN（3x3） 包装:管件 |
| ADN4694E | 制造商:AD 制造商全称:Analog Devices 功能描述:3.3 V, 100 Mbps, Half- and Full-Duplex |
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