参数资料
型号: ADP121CB-3.3-EVALZ
厂商: Analog Devices Inc
文件页数: 17/20页
文件大小: 0K
描述: BOARD EVAL ADP121-1 3.3V OUTPUT
设计资源: Low power, Long Range, ISM Wireless Measuring Node (CN0164)
标准包装: 1
每 IC 通道数: 1 - 单
输出电压: 3.3V
电流 - 输出: 150mA
输入电压: 2.3 ~ 5.5 V
稳压器类型: 正,固定式
工作温度: -40°C ~ 125°C
板类型: 完全填充
已供物品:
已用 IC / 零件: ADP121
Data Sheet
ADP121
140
120
100
MAX JUNCTION TEMPERATURE
GND
ANALOG DEVICES
ADP121-xx-EVALZ
GND
80
C1
U1
C2
60
40
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
= 1mA
= 10mA
= 25mA
= 50mA
= 75mA
= 100mA
20
I LOAD
= 150mA
VIN
J1
VOUT
0
0.5
1.0
1.5
2.0 2.5 3.0
3.5
4.0
4.5
V IN – V OUT (V)
Figure 46. TSOT, 100 mm 2 of PCB Copper, Board Temperature = 85°C
140
120
MAX JUNCTION TEMPERATURE
GND
EN
GND
Figure 48. Example of TSOT PCB Layout
100
80
60
40
20
0
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
= 1mA
= 10mA
= 25mA
= 50mA
= 75mA
= 100mA
= 150mA
0.5
1.0
1.5
2.0 2.5 3.0
3.5
4.0
4.5
V IN – V OUT (V)
Figure 47. WLCSP, 100 mm 2 of PCB Copper, Board Temperature = 85°C
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP121. However,
as can be seen from Table 6 and Table 7, a point of diminishing
Figure 49. Example of WLCSP PCB Layout—Top Side
returns is eventually reached, beyond which an increase in the
copper size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use 0402 or 0603 size capacitors and
resistors to achieve the smallest possible footprint solution on
boards where area is limited.
Figure 50. Example of WLCSP PCB Layout—Bottom Side
Rev. G | Page 17 of 20
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