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参数资料
| 型号： | ADP150CB-3.3-EVALZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION 3.3V WLCSP |
| 设计资源： | Broadband Low EVM Direct Conversion Transmitter (CN0134) Broadband Low EVM Direct Conversion Transmitter Using LO Divide-by-2 Modulator (CN0144) Using low noise linear drop-out regulators to power wideband PLL & VCO IC's (CN0147) |
| 标准包装： | 1 |
| 每 IC 通道数： | 1 - 单 |
| 输出电压： | 3.3V |
| 电流 - 输出： | 150mA |
| 输入电压： | 2.2 ~ 5.5V |
| 稳压器类型： | 正，固定式 |
| 工作温度： | -40°C ~ 125°C |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ADP150 |
ADP150
THERMAL CONSIDERATIONS
In most applications, the ADP150 does not dissipate much heat
due to its high efficiency. However, in applications with high
ambient temperature and high supply voltage to output voltage
differential, the heat dissipated in the package is large enough
that it can cause the junction temperature of the die to exceed
the maximum junction temperature of 125°C.
When the junction temperature exceeds 150°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature decreases below 135°C to prevent any permanent
Data Sheet
Power dissipation due to ground current is quite small and can be
ignored. Therefore, the junction temperature equation simplifies to
T J = T A + {[( V IN ? V OUT ) × I LOAD ] × θ JA } (3)
As shown in the previous equation, for a given ambient temperature,
input-to-output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
ensure that the junction temperature does not rise above 125°C.
for the different ambient temperatures, load currents, V IN -to-V OUT
differentials, and areas of PCB copper.
damage. Therefore, thermal analysis for the chosen application is
very important to guarantee reliable performance over all conditions.
140
MAX JUNCTION TEMPERATURE
The junction temperature of the die is the sum of the ambient
temperature of the environment and the temperature rise of the
package due to the power dissipation, as shown in Equation 2.
To guarantee reliable operation, the junction temperature of
the ADP150 must not exceed 125°C. To ensure that the junction
temperature stays below 125°C, be aware of the parameters that
contribute to the junction temperature changes. These parameters
include ambient temperature, power dissipation in the power
device, and thermal resistances between the junction and
120
100
80
60
40
20
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
I LOAD
= 1mA
= 10mA
= 25mA
= 50mA
= 75mA
= 100mA
= 150mA
ambient air (θ JA ). The θ JA number is dependent on the package
assembly compounds that are used and the amount of copper
used to solder the package GND pins to the PCB. Table 7 shows
0
0.5
1.0
1.5
2.0 2.5 3.0
V IN – V OUT (V)
3.5
4.0
4.5
typical θ JA values of the 5-lead TSOT and 4-ball WLCSP packages
for various PCB copper sizes. Table 8 shows the typical Ψ JB
value of the 5-lead TSOT and 4-ball WLCSP.
140
Figure 33. TSOT, 500 mm 2 of PCB Copper, T A = 25°C
Table 7. Typical θJA Values
Copper Size (mm 2 )
0 1
50
100
300
500
TSOT
170
152
146
134
131
θ JA (°C/W)
WLCSP
260
159
157
153
151
120
100
80
60
40
MAX JUNCTION TEMPERATURE
I LOAD = 1mA
I LOAD = 10mA
I LOAD = 25mA
I LOAD = 50mA
I LOAD = 75mA
I LOAD = 100mA
I LOAD = 150mA
1
Device soldered to minimum size pin traces.
20
Table 8. Typical Ψ JB Values
Ψ JB (°C/W)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TSOT
42.8
WLCSP
58.4
V IN – V OUT (V)
Figure 34. TSOT, 100 mm 2 of PCB Copper, T A = 25°C
Use Equation 2 to calculate the junction temperature.
T J = T A + ( P D × θ JA )
(2)
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
P D = [( V IN ? V OUT ) × I LOAD ] + ( V IN × I GND )
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are input and output voltages, respectively.
Rev. B | Page 14 of 20
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相关代理商/技术参数 |
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| ADP151_VD | 制造商:AD 制造商全称:Analog Devices 功能描述:Ultralow Noise, 200 mA, CMOS Linear Regulator |
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