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| 型号： | ADP151ACBZ-2.85-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 15/24页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.85V .2A 4WLCSP |
| 产品变化通告： | 8mm Carrier Tape Changes 28/Feb/2012 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.85V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.135V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA（最小值） |
| 电流 - 限制（最小）： | 220mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-WFBGA，WLCSP |
| 供应商设备封装： | 4-WLCSP（0.76x0.76） |
| 包装： | 标准包装 |
| 其它名称： | ADP151ACBZ-2.85-R7DKR |
Data Sheet
CURRENT-LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP151 is protected against damage due to excessive
power dissipation by current and thermal overload protection
circuits. The ADP151 is designed to current limit when the
output load reaches 300 mA (typical). When the output load
exceeds 300 mA, the output voltage is reduced to maintain a
constant current limit.
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and
power dissipation) when the junction temperature starts to
rise above 150°C, the output is turned off, reducing the output
current to 0. When the junction temperature drops below
135°C, the output is turned on again, and output current is
ADP151
To guarantee reliable operation, the junction temperature of
the ADP151 must not exceed 125°C. To ensure that the junction
temperature stays below this maximum value, the user must be
aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the power device, and thermal resistances between
the junction and ambient air (θ JA ). The θ JA number is dependent
on the package assembly compounds that are used and the amount
of copper used to solder the package GND pins to the PCB.
LFCSP, and 4-ball WLCSP packages for various PCB copper sizes.
LFCSP, and 4-ball WLCSP.
Table 6. Typical θ JA Values
θ JA (°C/W)
restored to its nominal value.
Copper Size (mm 2 )
TSOT
WLCSP
LFCSP
Device soldered to minimum size pin traces.
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP151 current limits, so that only 300 mA
is conducted into the short. If self-heating of the junction
causes its temperature to rise above 150°C, thermal shutdown
activates, turning off the output and reducing the output current
to 0. As the junction temperature cools and drops below
50 152
100 146
300 134
500 131
1
260
159
157
153
151
231.2
161.8
150.1
111.5
91.8
135°C, the output turns on and conducts 300 mA into the
short, again causing the junction temperature to rise above
150°C. This thermal oscillation between 135°C and 150°C causes a
current oscillation between 300 mA and 0 mA that continues
as long as the short remains at the output.
Current- and thermal-limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so that junction temperatures do not exceed 125°C.
THERMAL CONSIDERATIONS
In most applications, the ADP151 does not dissipate much heat
due to its high efficiency. However, in applications with a high
ambient temperature and a high supply voltage to output voltage
Table 7. Typical Ψ JB Values
Model Ψ JB (°C/W)
TSOT 43
WLCSP 58
LFCSP 28.3
The junction temperature of the ADP151 can be calculated
from the following equation:
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
P D = [( V IN ? V OUT ) × I LOAD ] + ( V IN × I GND )
(2)
(3)
differential, the heat dissipated in the package can cause the
junction temperature of the die to exceed the maximum junction
temperature of 125°C.
When the junction temperature exceeds 150°C, the converter
enters thermal shutdown. It recovers only after the junction
temperature has decreased below 135°C to prevent any permanent
damage. Therefore, thermal analysis for the chosen application
is very important to guarantee reliable performance over all
conditions. The junction temperature of the die is the sum of
the ambient temperature of the environment and the tempera-
ture rise of the package due to the power dissipation, as shown
in Equation 2.
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
T J = T A + {[( V IN ? V OUT ) × I LOAD ] × θ JA } (4)
As shown in Equation 4, for a given ambient temperature, input-to-
output voltage differential, and continuous load current, there
exists a minimum copper size requirement for the PCB to ensure
through Figure 59 show junction temperature calculations for
various ambient temperatures, load currents, V IN -to-V OUT
differentials, and areas of PCB copper.
Rev. E | Page 15 of 24
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