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参数资料
| 型号： | ADP1614ACPZ-650-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC REG BOOST ADJ 4A 10LFCSP |
| 标准包装： | 1,500 |
| 类型： | 升压（升压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2.5 V ~ 20 V |
| 输入电压： | 2.5 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 650kHz |
| 电流 - 输出： | 4A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 10-LFCSP-WD（3x3） |
Data Sheet
PCB LAYOUT GUIDELINES
For high efficiency, good regulation, and stability, a well designed
PCB layout is required.
for a block diagram and Figure 3 for a pin configuration).
ADP1614
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Keep the low ESR input capacitor (C IN ), which is labeled as
C4 in Figure 35, close to VIN and GND. This minimizes
noise injected into the part from board parasitic inductance.
Keep the high current path from C IN through the L1 inductor
to SW and GND as short as possible.
Keep the high current path from VIN through the inductor
(L1), the rectifier (D1), and the output capacitor (C OUT ),
which is labeled as C7 in Figure 35, as short as possible.
Keep high current traces as short and as wide as possible.
Place the feedback resistors as close to FB as possible to
prevent noise pickup. Connect the ground of the feedback
network directly to an AGND plane that makes a Kelvin
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connection to the GND pin.
Place the compensation components as close as possible to
COMP. Connect the ground of the compensation network
directly to an AGND plane that makes a Kelvin connection
to the GND pin.
Connect the soft start capacitor (C SS ), which is labeled as
C1 in Figure 35, as close as possible to the device. Connect
the ground of the soft start capacitor to an AGND plane
that makes a Kelvin connection to the GND pin.
Connect the current-limit set resistor (R CL ), which is
labeled as R4 in Figure 35, as close as possible to the device.
Connect the ground of the CL resistor to an AGND plane
that makes a Kelvin connection to the GND pin.
The PCB must be properly designed to conduct the heat
away from the package. This is achieved by adding thermal
vias to the PCB, which provide a thermal path to the inner
or bottom layers. Thermal vias should be placed on the
PCB underneath the exposed pad of the LFCSP and in the
GND plane around the ADP1614 package to improve
thermal performance of the package.
Figure 35. ADP1614 Recommended Top Layer Layout for the Adjustable
Current-Limit Boost Application
Avoid routing high impedance traces from the compensation
and feedback resistors near any node connected to SW or near
Figure 36. ADP1614 Recommended Bottom Layer Layout for the Adjustable
Current-Limit Boost Application
the inductor to prevent radiated noise injection.
Rev. A | Page 17 of 20
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