参数资料
型号: ADP1614ACPZ-650-R7
厂商: Analog Devices Inc
文件页数: 5/20页
文件大小: 0K
描述: IC REG BOOST ADJ 4A 10LFCSP
标准包装: 1,500
类型: 升压(升压)
输出类型: 可调式
输出数: 1
输出电压: 2.5 V ~ 20 V
输入电压: 2.5 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 650kHz
电流 - 输出: 4A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 10-WFDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 10-LFCSP-WD(3x3)

Data Sheet
ABSOLUTE MAXIMUM RATINGS
ADP1614
Table 2.
Parameter
VIN, EN, FB, FREQ to GND
CLRES to GND
COMP to GND
SS to GND
SW to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
?0.3 V to +6 V
?0.3 V to VIN
1.0 V to 1.6 V
?0.3 V to +1.3 V
21 V
?40°C to +125°C
?65°C to +150°C
JEDEC J-STD-020
THERMAL RESISTANCE
The junction-to-ambient thermal resistance (θ JA ) of the package
is specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The θ JA is highly
dependent on the application and board layout. In applications
where high maximum power dissipation exists, attention to
thermal board design is required. The value of θ JA may vary,
depending on the printed circuit board (PCB) material, layout,
and environmental conditions.
The boundary conditions for the thermal resistance of the
ADP1614 are modeled under natural convection cooling at
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
25°C ambient temperature, JESD 51-9, and 1 W power input on a
4-layer board.
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
Table 3. Thermal Resistance 1
Package Type
10-Lead LFCSP
θ JA
47
θ JC
7.22
Unit
°C/W
device reliability.
1
Thermal numbers per JEDEC standard JESD 51-9.
Absolute maximum ratings apply individually only, not in
combination.
ESD CAUTION
Rev. A | Page 5 of 20
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