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| 型号： | ADP1708-EVALZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADP1708 |
| 标准包装： | 1 |
| 每 IC 通道数： | 1 - 单 |
| 输出电压： | 1.6V |
| 电流 - 输出： | 1A |
| 输入电压： | 2.5 ~ 5.5V |
| 稳压器类型： | 正，可调式 |
| 工作温度： | -40°C ~ 125°C |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ADP1708 |
| 产品目录页面： | 793 (CN2011-ZH PDF) |
| 相关产品： | ADP1708ARDZ-R7DKR-ND - IC REG LDO ADJ 1A 8SOIC ADP1708ARDZ-R7CT-ND - IC REG LDO ADJ 1A 8SOIC ADP1708ARDZ-R7TR-ND - IC REG LDO ADJ 1A 8SOIC ADP1708ACPZ-R7TR-ND - IC REG LDO ADJ 1A 8-LFCSP |
ADP1706/ADP1707/ADP1708
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and
The junction temperature of the ADP1706/ADP1707/ADP1708
can be calculated by
power dissipation) when the junction temperature starts to
rise above 150°C, the output is turned off, reducing the output
current to zero. When the junction temperature drops below
135°C (typical), the output is turned on again and output
current is restored to its nominal value.
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
P D = [( V IN – V OUT ) × I LOAD ] + ( V IN × I GND )
(3)
(4)
Consider the case where a hard short from OUT to ground
occurs. At first, the ADP1706/ADP1707/ADP1708 reach
current limit so that only 1.5 A is conducted into the short. If
self-heating of the junction becomes great enough to cause its
temperature to rise above 150°C, thermal shutdown activates,
turning off the output and reducing the output current to
zero. As the junction temperature cools and drops below
135°C, the output turns on and conducts 1.5 A into the short,
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are the input and output voltages, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
again causing the junction temperature to rise above 150°C.
T J = T A + {[( V IN – V OUT ) × I LOAD ] × θ JA }
(5)
This thermal oscillation between 135°C and 150°C causes a
current oscillation between 1.5 A and 0 A that continues as
long as the short remains at the output.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation should be externally limited
so junction temperatures do not exceed 125°C.
As shown in Equation 5, for a given ambient temperature,
input-to-output voltage differential, and continuous load
current, a minimum copper size requirement exists for the PCB
to ensure the junction temperature does not rise above 125°C.
for different ambient temperatures, load currents, V IN to V OUT
differentials, and areas of PCB copper.
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of
the ADP1706/ADP1707/ADP1708 must not exceed 125°C. To
ensure that the junction temperature stays below this maximum
value, the user needs to be aware of the parameters that contrib-
ute to junction temperature changes. These parameters include
ambient temperature, power dissipation in the power device,
and thermal resistance between the junction and ambient air (θ JA ).
The θ JA value is dependent on the package assembly compounds
used and the amount of copper to which the GND pins of the
140
120
100
80
60
40
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
package are soldered on the PCB. Table 5 shows typical θ JA values
of the 8-lead SOIC and 8-lead LFCSP for various PCB copper sizes.
20
0
1mA
10mA
100mA
300mA
500mA
750mA
1A
(LOAD CURRENT)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Table 5. Typical θ JA Values
V IN – V OUT (V)
Copper Size (mm 2 )
50
100
300
500
θ JA (°C/W), SOIC
57.6
53.1
52.3
51.3
51.3
θ JA (°C/W), LFCSP
65.9
62.3
61.2
59.7
59.4
Figure 36. 500 mm 2 of PCB Copper, T A = 25°C, SOIC
1
Device soldered to minimum size pin traces.
Rev. 0 | Page 13 of 20
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP1708-EVALZ | 制造商:Analog Devices 功能描述:ADP1708, LDO, CMOS, EVALUATION BOARD |
| ADP170AUJZ-1.25-R7 | 功能描述:Linear Voltage Regulator IC Positive Fixed 1 Output 1.25V 300mA TSOT-5 制造商:analog devices inc. 系列:- 包装:带卷（TR） 零件状态:有效 稳压器拓扑:正，固定式 电压 - 输出:1.25V 电流 - 输出:300mA 电压 - 跌落（典型值）:- 稳压器数:1 电压 - 输入:1.6 V ~ 3.6 V 电流 - 限制（最小值）:400mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商器件封装:TSOT-5 标准包装:3,000 |
| ADP170AUJZ-1.2-R7 | 功能描述:IC REG LDO 1.2V .3A TSOT23-5 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.12V @ 150mA 稳压器数量:1 电流 - 输出:150mA（最小值） 电流 - 限制（最小）:220mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) 其它名称:ADP160AUJZ-3.0-R7TR |
| ADP170AUJZ-1.5-R7 | 功能描述:IC REG LDO 1.5V .3A TSOT23-5 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:最高 5.5V 电压 - 压降（标准）:0.12V @ 150mA 稳压器数量:1 电流 - 输出:150mA（最小值） 电流 - 限制（最小）:220mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) 其它名称:ADP160AUJZ-3.0-R7TR |
| ADP170AUJZ-1.8-R7 | 功能描述:IC REG LDO 1.8V .3A TSOT23-5 RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3V 输入电压:2.3 V ~ 5.5 V 电压 - 压降（标准）:0.035V @ 150mA 稳压器数量:2 电流 - 输出:150mA 电流 - 限制（最小）:300mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:6-UFDFN 裸露焊盘，6-TMLF? 供应商设备封装:6-TMLF?（1.6x1.6） 包装:Digi-Reel® 产品目录页面:1104 (CN2011-ZH PDF) 其它名称:576-3018-6 |
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