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参数资料
| 型号： | ADP170AUJZ-2.8-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 15/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.8V .3A TSOT23-5 |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.8V |
| 输入电压： | 最高 3.6V |
| 电压 - 压降（标准）： | 0.066V @ 300mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 300mA（最小值） |
| 电流 - 限制（最小）： | 400mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-5 细型，TSOT-23-5 |
| 供应商设备封装： | TSOT-23-5 |
| 包装： | 标准包装 |
| 其它名称： | ADP170AUJZ-2.8-R7DKR |
Data Sheet
140
120
T J MAX
140
120
T J MAX
ADP170/ADP171
100
I LOAD = 300mA
100
I LOAD = 300mA
I LOAD = 150mA
80
60
I LOAD = 150mA
I LOAD = 100mA
80
60
I LOAD = 100mA
I LOAD = 25mA
40
I LOAD = 25mA
40
I LOAD = 1mA
I LOAD = 10mA
20
I LOAD = 1 m A
I LOAD = 10mA
20
0
0.5
1.0
1.5
2.0
2.5
3.0
0
0.5
1.0
1.5
2.0
2.5
3.0
V IN – V OUT (V)
Figure 35. 0 mm 2 of PCB Copper, T A = 25°C
V OUT – V IN (V)
Figure 38. 0 mm 2 of PCB Copper, T A = 50°C
140
120
100
T J MAX
I LOAD = 300mA
I LOAD = 150mA
In cases where board temperature is known, use the thermal
characterization parameter, Ψ JB , to estimate the junction tem-
perature rise (see Figure 39). Maximum junction temperature
(T J ) is calculated from the board temperature (T B ) and power
dissipation (P D ) using the following formula:
80
I LOAD = 100mA
T J = T B + ( P D × Ψ JB )
(5)
60
I LOAD = 25mA
The typical value of Ψ JB is 42.8°C/W for the 5-lead TSOT package.
40
20
I LOAD = 1 mA
I LOAD = 10mA
140
120
0
0.5
1.0
1.5
2.0
2.5
3.0
100
V OUT – V IN (V)
80
140
Figure 36. 500 mm 2 of PCB Copper, T A = 50°C
60
I LOAD
I LOAD
= 1mA
= 10mA
I LOAD = 150mA
I LOAD = 250mA
120
T J MAX
40
I LOAD
I LOAD
= 50mA
= 100mA
I LOAD = 300mA
T J MAX
I LOAD = 300mA
100
I LOAD = 150mA
20
80
I LOAD = 100mA
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
V IN – V OUT (V)
60
40
20
I LOAD = 25mA
I LOAD = 1mA
I LOAD = 10mA
Figure 39. TSOT, T A = 85°C
0
0.5
1.0
1.5
2.0
2.5
3.0
V OUT – V IN (V)
Figure 37. 100 mm 2 of PCB Copper, T A = 50°C
Rev. C | Page 15 of 20
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