参数资料
型号: ADP1711AUJZ-0.9-R7
厂商: Analog Devices Inc
文件页数: 11/16页
文件大小: 0K
描述: IC REG LDO 0.9V .15A TSOT-23-5
产品培训模块: Power Line Monitoring
标准包装: 1
稳压器拓扑结构: 正,固定式
输出电压: 0.9V
输入电压: 2.5 V ~ 5.5 V
稳压器数量: 1
电流 - 输出: 150mA(最小值)
电流 - 限制(最小): 180mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SOT-23-5 细型,TSOT-23-5
供应商设备封装: TSOT-23-5
包装: 标准包装
产品目录页面: 793 (CN2011-ZH PDF)
配用: ADP1711-2.5-EVALZ-ND - BOARD EVAL FOR ADP1711-2.5
其它名称: ADP1711AUJZ-0.9-R7DKR
ADP1710/ADP1711
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited
so junction temperatures do not exceed 125°C.
140
120
100
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
THERMAL CONSIDERATIONS
80
To guarantee reliable operation, the junction temperature of the
ADP1710/ADP1711 must not exceed 125°C. To ensure the
junction temperature stays below this maximum value, the user
needs to be aware of the parameters that contribute to junction
60
40
temperature changes. These parameters include ambient
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θ JA ). The θ JA
20
0
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pins of the package
are soldered on the PCB. Table 5 shows typical θ JA values of the
0.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0
V IN – V OUT (V)
Figure 23. 500 mm 2 of PCB Copper, T A = 25°C
4.5
5.0
5-lead TSOT package for various PCB copper sizes.
140
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
Table 5.
Copper Size (mm 2 )
θ JA (°C/W)
120
50
100
300
500
170
152
146
134
131
100
80
60
1
Device soldered to minimum size pin traces.
40
The junction temperature of the ADP1710/ADP1711 can be
calculated from the following equation:
20
0
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
T J = T A + ( P D × θ JA )
(2)
0.5
1.0
1.5
2.0
2.5 3.0
V IN – V OUT (V)
3.5
4.0
4.5
5.0
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
140
Figure 24. 100 mm 2 of PCB Copper, T A = 25°C
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
P D = [( V IN – V OUT ) × I LOAD ] + ( V IN × I GND )
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are the input voltage and output voltage,
respectively.
(3)
120
100
80
60
40
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
20
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
0
T J = T A + {[( V IN – V OUT ) × I LOAD ] × θ JA }
(4)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
As shown in Equation 4, for a given ambient temperature, input
to output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
ensure the junction temperature does not rise above 125°C. The
following figures show junction temperature calculations for
different ambient temperatures, load currents, V IN to V OUT
differentials, and areas of PCB copper.
Rev. 0 | Page 11 of 16
V IN – V OUT (V)
Figure 25. 0 mm 2 of PCB Copper, T A = 25°C
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