参数资料
型号: ADP1711AUJZ-3.0-R7
厂商: Analog Devices Inc
文件页数: 12/16页
文件大小: 0K
描述: IC REG LDO 3V .15A TSOT-23-5
产品培训模块: Power Line Monitoring
标准包装: 1
稳压器拓扑结构: 正,固定式
输出电压: 3V
输入电压: 最高 5.5V
电压 - 压降(标准): 0.15V @ 150mA
稳压器数量: 1
电流 - 输出: 150mA(最小值)
电流 - 限制(最小): 180mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SOT-23-5 细型,TSOT-23-5
供应商设备封装: TSOT-23-5
包装: 标准包装
产品目录页面: 793 (CN2011-ZH PDF)
配用: ADP1711-2.5-EVALZ-ND - BOARD EVAL FOR ADP1711-2.5
其它名称: ADP1711AUJZ-3.0-R7DKR
ADP1710/ADP1711
140
120
100
80
60
40
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP1710/
ADP1711. However, as can be seen from Table 5, a point of
diminishing returns eventually is reached, beyond which an
increase in the copper size does not yield significant heat
dissipation benefits.
Place the input capacitor as close as possible to the IN and GND
20
0
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
pins. Place the output capacitor as close as possible to the OUT
and GND pins. For ADP1711, place the internal reference
bypass capacitor as close as possible to the BYP pin. Use of 0402
0.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0
V IN – V OUT (V)
Figure 26. 500 mm 2 of PCB Copper, T A = 50°C
4.5
5.0
or 0603 size capacitors and resistors achieves the smallest
possible footprint solution on boards where area is limited.
140
120
100
80
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
GND (BOTTOM)
GND (TOP)
ADP1710/
ADP1711
60
40
20
IN
C1
C2
OUT
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
V IN – V OUT (V)
C3
R1
140
120
100
80
60
40
20
Figure 27. 100 mm 2 of PCB Copper, T A = 50°C
MAX T J (DO NOT OPERATE ABOVE THIS POINT)
EN
Figure 29. Example PCB Layout
R2
1mA
10mA
30mA
80mA
100mA
125mA
150mA
(LOAD CURRENT)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
V IN – V OUT (V)
Figure 28. 0 mm 2 of PCB Copper, T A = 50°C
Rev. 0 | Page 12 of 16
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