参数资料
型号: ADP1715-3.3-EVALZ
厂商: Analog Devices Inc
文件页数: 13/20页
文件大小: 0K
描述: BOARD EVAL FOR ADP1715-3.3
标准包装: 1
每 IC 通道数: 1 - 单
输出电压: 3.3V
电流 - 输出: 500mA
输入电压: 2.5 ~ 5.5V
稳压器类型: 正,固定式
工作温度: -40°C ~ 125°C
板类型: 完全填充
已供物品:
已用 IC / 零件: ADP1715
相关产品: ADP1715ARMZ-1.05R7TR-ND - IC REG LDO 1.05V .5A 8-MSOP
ADP1715ARMZ-3.3-R7DKR-ND - IC REG LDO 3.3V .5A 8-MSOP
ADP1715ARMZ-3.0-R7DKR-ND - IC REG LDO 3V .5A 8-MSOP
ADP1715ARMZ-2.5-R7DKR-ND - IC REG LDO 2.5V .5A 8-MSOP
ADP1715ARMZ-1.8-R7DKR-ND - IC REG LDO 1.8V .5A 8-MSOP
ADP1715ARMZ-1.5-R7DKR-ND - IC REG LDO 1.5V .5A 8-MSOP
ADP1715ARMZ-1.3-R7DKR-ND - IC REG LDO 1.3V .5A 8-MSOP
ADP1715ARMZ-1.2-R7DKR-ND - IC REG LDO 1.2V .5A 8-MSOP
ADP1715ARMZ-3.3-R7CT-ND - IC REG LDO 3.3V .5A 8-MSOP
ADP1715ARMZ-3.0-R7CT-ND - IC REG LDO 3V .5A 8-MSOP
更多...
ADP1715/ADP1716
should be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient
140
120
DO NOT OPERATE ABOVE THIS POINT
temperature, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θ JA ). The θ JA
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pins of the package
are soldered to on the PCB. Table 5 shows typical θ JA values of the
8-lead thermally enhanced MSOP package for various PCB
copper sizes.
100
80
60
40
MAX T J
Table 5.
20
1mA
50mA
250mA
500mA
Copper Size (mm )
2
θ JA (°C/W)
0
10mA
100mA
360mA
(LOAD CURRENT)
0 1
118
0
1
2
3
4
5
100
300
500
700
99
77
75
74
140
V IN – V OUT (V)
Figure 34. 700 mm 2 of PCB Copper, T A = 25°C
DO NOT OPERATE ABOVE THIS POINT
1
Device soldered to minimum size pin traces.
120
MAX T J
The junction temperature of the ADP1715/ADP1716 can be
calculated from the following equation:
100
80
T J = T A + ( P D × θ JA )
(3)
60
where:
40
T A is the ambient temperature.
P D is the power dissipation in the die, given by
20
1mA
50mA
250mA
500mA
P D = [( V IN – V OUT ) × I LOAD ] + ( V IN × I GND )
(4)
0
0
10mA
1
100mA
2
360mA
3
(LOAD CURRENT)
4
5
where:
V IN – V OUT (V)
Figure 35. 300 mm 2 of PCB Copper, T A = 25°C
I LOAD is the load current.
I GND is ground current.
V IN and V OUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
140
120
100
80
DO NOT OPERATE ABOVE THIS POINT
MAX T J
T J = T A + {[( V IN – V OUT ) × I LOAD ] × θ JA }
(5)
60
As shown in Equation 5, for a given ambient temperature, input
to output voltage differential, and continuous load current,
there exists a minimum copper size requirement for the PCB to
40
20
ensure the junction temperature does not rise above 125°C. The
1mA
10mA
50mA
100mA
250mA
360mA
500mA
(LOAD CURRENT)
following figures show junction temperature calculations for
0
0
1
2
3
4
5
different ambient temperatures, load currents, V IN to V OUT
differentials, and areas of PCB copper.
Rev. 0 | Page 13 of 20
V IN – V OUT (V)
Figure 36. 100 mm 2 of PCB Copper, T A = 25°C
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