参数资料
型号: ADP1870-BL1-EVZ
厂商: Analog Devices Inc
文件页数: 5/44页
文件大小: 0K
描述: EVAL BOARD FOR ADP1870
标准包装: 1
主要目的: DC/DC,步降
稳压器拓扑结构: 降压
板类型: 裸(未填充)
已供物品: 裸板
已用 IC / 零件: ADP1870

Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
ADP1870/ADP1871
Parameter
VREG to PGND, GND
VIN to PGND
FB, COMP/EN to GND
Rating
?0.3 V to +6 V
?0.3 V to +28 V
?0.3 V to (V REG + 0.3 V)
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
DRVL to PGND
SW to PGND
BST to SW
BST to PGND
DRVH to SW
PGND to GND
?0.3 V to (V REG + 0.3 V)
?2.0 V to +28 V
?0.6 V to (V REG + 0.3 V)
?0.3 V to 28 V
?0.3 V to V REG
± 0.3 V
Package Type
θ JA (10-Lead MSOP)
2-Layer Board
4- Layer Board
θ JA (10-Lead LFCSP)
4- Layer Board
θ JA1
213.1
171.7
40
Unit
°C/W
°C/W
°C/W
θ JA (10-Lead MSOP)
2-Layer Board
4-Layer Board
213.1°C/W
171.7°C/W
1
θ JA is specified for the worst-case conditions; that is, θ JA is specified for the
device soldered in a circuit board for surface-mount packages.
θ JA (10-Lead LFCSP)
4-Layer Board
Operating Junction Temperature
Range
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead
40°C/W
?40°C to +125°C
?65°C to +150°C
JEDEC J-STD-020
300°C
BOUNDARY CONDITION
In determining the values given in Table 2 and Table 3, natural
convection was used to transfer heat to a 4-layer evaluation board.
ESD CAUTION
Temperature (10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
Rev. B | Page 5 of 44
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