参数资料
型号: ADP2107-EVALZ
厂商: Analog Devices Inc
文件页数: 6/36页
文件大小: 0K
描述: BOARD EVALUATION FOR ADP2107
产品培训模块: Powering 90nm/65nm FPGAs and Processors
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 1,非隔离
输出电压: 2.5V
电流 - 输出: 2A
输入电压: 2.7 ~ 5.5 V
稳压器拓扑结构: 降压
频率 - 开关: 1.2MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: ADP2107
相关产品: ADP2107ACPZ-R7DKR-ND - IC REG BUCK SYNC ADJ 2A 16LFCSP
ADP2107ACPZ-3.3-R7DKR-ND - IC REG BUCK SYNC 3.3V 2A 16LFCSP
ADP2107ACPZ-1.8-R7DKR-ND - IC REG BUCK SYNC 1.8V 2A 16LFCSP
ADP2107ACPZ-1.5-R7DKR-ND - IC REG BUCK SYNC 1.5V 2A 16LFCSP
ADP2107ACPZ-1.2-R7DKR-ND - IC REG BUCK SYNC 1.2V 2A 16LFCSP
ADP2107ACPZ-R7CT-ND - IC REG BUCK SYNC ADJ 2A 16LFCSP
ADP2107ACPZ-3.3-R7CT-ND - IC REG BUCK SYNC 3.3V 2A 16LFCSP
ADP2107ACPZ-1.8-R7CT-ND - IC REG BUCK SYNC 1.8V 2A 16LFCSP
ADP2107ACPZ-1.5-R7CT-ND - IC REG BUCK SYNC 1.5V 2A 16LFCSP
ADP2107ACPZ-1.2-R7CT-ND - IC REG BUCK SYNC 1.2V 2A 16LFCSP
更多...

ADP2105/ADP2106/ADP2107
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Data Sheet
Parameter
IN, EN, SS, COMP, FB to AGND
Rating
?0.3 V to +6 V
θ JA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
LX1, LX2 to PGND
PWIN1, PWIN2 to PGND
PGND to AGND
GND to AGND
PWIN1, PWIN2 to IN
?0.3 V to (V IN + 0.3 V)
?0.3 V to +6 V
?0.3 V to +0.3 V
?0.3 V to +0.3 V
?0.3 V to +0.3 V
Table 3. Thermal Resistance
Package Type
16-Lead LFCSP_VQ/QFN
Maximum Power Dissipation
θ JA
40
1
Unit
°C/W
W
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
?40°C to +125°C
?65°C to +150°C
JEDEC J-STD-020
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to the PCB.
Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. D | Page 6 of 36
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