参数资料
| 型号： | ADP3050AR-3.3 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 16/20页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK 3.3V 1A 8SOIC |
| 标准包装： | 98 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 3.3V |
| 输入电压： | 3.6 V ~ 30 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 200kHz |
| 电流 - 输出： | 1A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 包装： | 管件 |
| 供应商设备封装： | 8-SO |
| 配用： | ADP3050-EVAL-ND - BOARD EVAL FOR ADP3050 |
ADP3050
Data Sheet
V IN ( MIN ) =
P SW = ? ? 0 . 8 × 0 . 6 ×
? +
V OUT + V SAT
0 . 85
THERMAL CONSIDERATIONS
(12)
3 . 3 ?
? 5 . 0 ?
( 50 × 10 ? 9 × 0 . 8 × 5 . 0 × 200 × 10 3 ) = 357 mW
P BOOST =
0 . 8 3 . 3 2
P Q = ( 5 × 10 ? 3 ) + ( 3 . 3 × 4 × 10 ? 3 ) = 18 mW
Several factors contribute to IC power dissipation: ac and dc
switch losses, boost current, and quiescent current. The following
formulas are used to calculate these losses to determine the power
dissipation of the IC. These formulas assume continuous mode
operation, but they provide a reasonable estimate for disconti-
nuous mode systems (do not use these formulas to calculate
efficiency at light loads).
Switch loss
× = 35 mW
50 5 . 0
For a total IC power dissipation of
P TOTAL = P SW + P BOOST + P Q = 410 mW (16)
The ADP3050 is offered in a thermally enhanced (not Pb-free)
8-lead SOIC package with a thermal resistance, θ JA , of 60.6°C/W,
P SW = ? ? I OUT × V SAT × OUT
? + ( t OV × I OUT × V IN × f SW )
?
? V
Boost current loss
? V IN
?
?
(13)
and in a standard Pb-free 8-lead SOIC package with θ JA of
87.5°C/W.
The maximum die temperature, T J , is calculated using the
thermal resistance and the maximum ambient temperature
I OUT
V
P BOOST = × OUT
2
β SW V IN
Quiescent current loss
P Q = ( V IN × I Q ) + ( V OUT × I BIAS )
where:
f SW is the switch frequency (200 kHz).
t OV is the switch current/voltage overlap time (~50 ns).
β SW is the current gain of the NPN power switch (~50).
I Q is the quiescent current drawn from V IN (~1 mA).
I BIAS is the quiescent current drawn from V OUT (~4 mA).
For example, a 5 V to 3.3 V system with I OUT = 800 mA
(14)
(15)
T J = T A + θ JA × P TOTAL (17)
For the previous example (5 V to 3.3 V at 800 mA system, Pb-
free 8-lead SOIC package using good layout techniques) with a
worst-case ambient temperature of 70°C
T J = 70° C + 87.5° C/W × 0.41 = 105.9° C
The maximum operating junction (die) temperature is 125°C,
therefore this system operates within the safe limits of the
ADP3050. Check the die temperature at minimum and
maximum supply voltages to ensure proper operation under all
conditions. Although the PCB and its copper traces provide
sufficient heat sinking, it is important to follow the layout
suggestions in the Board Layout Guidelines section. For any
design that combines high output current with high duty cycle
and/or high input voltage, the junction temperature must be
calculated to ensure normal operation. Always use the
equations in this section to estimate the power dissipation.
Rev. C | Page 16 of 20
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP3050AR-5 | 制造商:Analog Devices 功能描述:Conv DC-DC Single Step Down 3.6V to 30V 8-Pin SOIC N 制造商:Rochester Electronics LLC 功能描述:HIGH VOLTAGE STEP DOWN SWITCHING REG. - Bulk 制造商:Analog Devices 功能描述:IC SWITCHING REGULATOR |
| ADP3050AR-5-REEL | 制造商:Analog Devices 功能描述:Conv DC-DC Single Step Down 3.6V to 30V 8-Pin SOIC N T/R |
| ADP3050AR-5-REEL7 | 制造商:Analog Devices 功能描述:Conv DC-DC Single Step Down 3.6V to 30V 8-Pin SOIC N T/R 制造商:Analog Devices 功能描述:ANAADP3050AR-5-REEL7 HI VOLT SWCH REG |
| ADP3050AR-REEL | 制造商:Analog Devices 功能描述:Conv DC-DC Single Step Down 3.6V to 30V 8-Pin SOIC N T/R |
| ADP3050AR-REEL7 | 制造商:Analog Devices 功能描述:Conv DC-DC Single Step Down 3.6V to 30V 8-Pin SOIC N T/R 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
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