参数资料
型号: ADS8364Y/2K
厂商: Texas Instruments
文件页数: 15/26页
文件大小: 0K
描述: IC ADC LP 16BIT 250KSPS 64-TQFP
产品培训模块: Data Converter Basics
标准包装: 2,000
位数: 16
采样率(每秒): 250k
数据接口: 并联
转换器数目: 6
功率耗散(最大): 471.5mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-TQFP
供应商设备封装: 64-TQFP(10x10)
包装: 带卷 (TR)
输入数目和类型: 12 个单端,双极;6 个差分,双极
配用: 296-30708-ND - EVAL MODULE FOR ADS8364
ADS8364EVM-ND - EVALUATION MODULE FOR BQ2018
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
ADS8364Y/250
ACTIVE
TQFP
PAG
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS8364Y/250G4
ACTIVE
TQFP
PAG
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS8364Y/2K
ACTIVE
TQFP
PAG
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
ADS8364Y/2KG4
ACTIVE
TQFP
PAG
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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