参数资料
型号: ADSP-21469KBCZ-3
厂商: Analog Devices Inc
文件页数: 5/72页
文件大小: 0K
描述: IC DSP 32/40BIT 400MHZ 324BGA
产品变化通告: Pin Function Change 08/Mar/2012
标准包装: 1
系列: SHARC®
类型: 浮点
接口: DAI,DPI,EBI/EMI,I²C,SCI,SPI,SSP,UART/USART
时钟速率: 400MHz
非易失内存: 外部
芯片上RAM: 5Mb
电压 - 输入/输出: 3.30V
电压 - 核心: 1.05V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 324-BGA,CSPBGA
供应商设备封装: 324-CSPBGA
包装: 托盘
ADSP-21469
Rev. 0
|
Page 13 of 72
|
June 2010
DDR2_ADDR15–0
O/T
High-Z/driven
low
DDR2 Address. DDR2 address pins.
DDR2_BA2-0
O/T
High-Z/driven
low
DDR2 Bank Address Input. Defines which internal bank an ACTIVATE, READ, WRITE,
or PRECHARGE command is being applied to. BA2–0define which mode registers,
including MR, EMR, EMR(2), and EMR(3) are loaded during the LOAD MODE REGISTER
command.
DDR2_CAS
O/T
High-Z/driven
high
DDR2 Column Address Strobe. Connect to DDR2_CAS pin; in conjunction with
other DDR2 command pins, defines the operation for the DDR2 to perform.
DDR2_CKE
O/T
High-Z/driven
low
DDR2 Clock Enable Output to DDR2. Active high signal. Connect to DDR2 CKE
signal.
DDR2_CS3-0
O/T
High-Z/driven
high
DDR2 Chip Select. All commands are masked when DDR2_CS3-0 is driven high.
DDR2_CS3-0 are decoded memory address lines. Each DDR2_CS3-0 line selects the
corresponding external bank.
DDR2_DATA15-0
I/O/T
High-Z
DDR2 Data In/Out. Connect to corresponding DDR2_DATA pins.
DDR2_DM1-0
O/T
High-Z/driven
high
DDR2 Input Data Mask. Mask for the DDR2 write data if driven high. Sampled on
both edges of DDR2_DQS at DDR2 side. DM0 corresponds to DDR2_DATA 7–0 and
DM1 corresponds to DDR2_DATA15–8.
DDR2_DQS1-0
I/O/T (Differential)
High-Z
Data Strobe. Output with Write Data. Input with Read Data. DQS0 corresponds to
DDR2_DATA 7–0 and DQS1 corresponds to DDR2_DATA 15–8. Based on software
control via the DDR2CTL3 register, this pin can be single-ended or differential.
DDR2_RAS
O/T
High-Z/driven
high
DDR2 Row Address Strobe. Connect to DDR2_RAS pin; in conjunction with other
DDR2 command pins, defines the operation for the DDR2 to perform.
DDR2_WE
O/T
High-Z/driven
high
DDR2 Write Enable. Connect to DDR2_WE pin; in conjunction with other DDR2
command pins, defines the operation for the DDR2 to perform.
DDR2_CLK0,
DDR2_CLK1,
DDR2_CLK1
O/T (Differential)
High-Z/driven
low
DDR2 Memory Clocks. Two differential outputs available via software control
(DDR2CTL0 register). Free running, minimum frequency not guaranteed during reset.
DDR2_ODT
O/T
High-Z/driven
low
DDR2 On Die Termination. ODT pin when driven high (along with other require-
ments) enables the DDR2 termination resistances. ODT is enabled/disabled
regardless of read or write commands.
Table 9. Pin Descriptions (Continued)
Name
Type
State During/
After Reset
Description
The following symbols appear in the Type column of Table 9: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive,
O/D = open-drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor.
The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic levels.
To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors cannot be
enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be between 26 k
–63 k. The range
of an ipd resistor can be between 31 k
–85 k.
In this table, the DDR2 pins are SSTL18 compliant. All other pins are LVTTL compliant.
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