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| 型号： | ADSP-21469KBCZ-3 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 59/72页 |
| 文件大小： | 0K |
| 描述： | IC DSP 32/40BIT 400MHZ 324BGA |
| 产品变化通告： | Pin Function Change 08/Mar/2012 |
| 标准包装： | 1 |
| 系列： | SHARC® |
| 类型： | 浮点 |
| 接口： | DAI，DPI，EBI/EMI，I²C，SCI，SPI，SSP，UART/USART |
| 时钟速率： | 400MHz |
| 非易失内存： | 外部 |
| 芯片上RAM： | 5Mb |
| 电压 - 输入/输出： | 3.30V |
| 电压 - 核心： | 1.05V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 324-BGA，CSPBGA |
| 供应商设备封装： | 324-CSPBGA |
| 包装： | 托盘 |
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Rev. 0
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Page 62 of 72
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June 2010
ADSP-21469
Values of JB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val-
ues provided in Table 56 are modeled values.
Thermal Diode
The ADSP-21469 processors incorporate thermal diodes to
monitor the die temperature. The thermal diode of is a
grounded collector PNP bipolar junction transistor (BJT). The
THD_P pin is connected to the emitter and the THD_M pin is
connected to the base of the transistor. These pins can be used
by an external temperature sensor (such as ADM 1021A or
LM86, or others) to read the die temperature of the chip.
The technique used by the external temperature sensor is to
measure the change in VBE when the thermal diode is operated
at two different currents. This is shown in the following
equation:
where:
n = multiplication factor close to 1, depending on process
variations
k = Boltzmann’s constant
T = temperature (°C)
q = charge of the electron
N = ratio of the two currents
The two currents are usually in the range of 10 μA to 300 μA for
the common temperature sensor chips available.
Table 57 contains the thermal diode specifications using the
transistor model. Note that Measured Ideality Factor already
takes into effect variations in beta ().
Table 56. Thermal Characteristics for 324-Lead CSP_BGA
Parameter
Condition
Typical
Unit
JA
Airflow = 0 m/s
22.7
°C/W
JMA
Airflow = 1 m/s
20.4
°C/W
JMA
Airflow = 2 m/s
19.5
°C/W
JC
6.6
°C/W
JT
Airflow = 0 m/s
0.11
°C/W
JMT
Airflow = 1 m/s
0.19
°C/W
JMT
Airflow = 2 m/s
0.24
°C/W
V
BE
n
kT
q
------
In(N)
=
Table 57. Thermal Diode Parameters—Transistor Model1
Symbol
Parameter
Min
Typ
Max
Unit
IFW
2
Forward Bias Current
10
300
A
IE
Emitter Current
10
300
A
nQ
3, 4
Transistor Ideality
1.012
1.015
1.017
RT
4, 5
Series Resistance
0.12
0.2
0.28
1 See the Engineer-to-Engineer Note EE-346.
2 Analog Devices does not recommend operation of the thermal diode under reverse bias.
3 Not 100% tested. Specified by design characterization.
4 The ideality factor, nQ, represents the deviation from ideal diode behavior as exemplified by the diode equation: IC = IS × (e qVBE/nqkT –1), where IS = saturation current,
q = electronic charge, VBE = voltage across the diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).
5 The series resistance (RT) can be used for more accurate readings as needed.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADSP-21469KBCZ-4 | 功能描述:IC DSP 32/40BIT 450MHZ 324BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:SHARC® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C，McASP，McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA，FCBGA 供应商设备封装:548-FCBGA（27x27） 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
| ADSP21469KBCZENG | 制造商:Analog Devices 功能描述: |
| ADSP-21469KBCZ-ENG | 制造商:Analog Devices 功能描述:FXD PT PROC - Trays |
| ADSP-21469KBCZ-X | 制造商:Analog Devices 功能描述:FXD PT PROC - Trays |
| ADSP-21469KBZ-EN | 制造商:Analog Devices 功能描述: |
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