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参数资料
| 型号： | ADSP-2186MKSTZ-300 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/40页 |
| 文件大小： | 0K |
| 描述： | IC DSP CONTROLLER 16BIT 100LQFP |
| 标准包装： | 1 |
| 系列： | ADSP-21xx |
| 类型： | 定点 |
| 接口： | 主机接口，串行端口 |
| 时钟速率： | 75MHz |
| 非易失内存： | 外部 |
| 芯片上RAM： | 40kB |
| 电压 - 输入/输出： | 3.30V |
| 电压 - 核心： | 2.50V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 100-LQFP |
| 供应商设备封装： | 100-LQFP（14x14） |
| 包装： | 托盘 |
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REV. 0
–20–
ADSP-2186M
Each address and data pin has a 10 pF total load at the pin.
The application operates at VDDEXT = 3.3 V and tCK = 30 ns.
Total Power Dissipation = PINT + (C
× V
DDEXT
2
× f)
PINT = internal power dissipation from Power vs. Frequency
graph (Figure 15).
(C
× V
DDEXT
2
× f ) is calculated for each output:
# of
C
VDDEXT
2
fPD
Parameters
Pins
pF
V
MHz
mW
Address
7
10
3.3
2
16.67
12.7
Data Output,
WR
9
10
3.3
2
16.67
16.3
RD
1
10
3.32
16.67
1.8
CLKOUT,
DMS
2
10
3.3
2
33.3
7.2
38.0
Total power dissipation for this example is PINT + 38.0 mW.
Output Drive Currents
Figure 14 shows typical I-V characteristics for the output drivers
on the ADSP-2186M. The curves represent the current drive
capability of the output drivers as a function of output voltage.
VOH
VOL
SOURCE VOLTAGE – V
0
0.5
1.0
SOURCE
CURRENT
–
mA
60
0
–20
–40
–60
40
20
VDDEXT = 3.6V @ –40 C
VDDEXT = 3.3V @ +25 C
VDDEXT = 2.5V @ +85 C
VDDEXT = 3.3V @ +25 C
VDDEXT = 3.6V @ –40 C
80
–80
1.5
2.0
2.5
3.0
3.5
4.0
Figure 14. Typical Output Driver Characteristics
FREQUENCY DEPENDENCY FOR TIMING
SPECIFICATIONS
tCK is defined as 0.5 tCKI. The ADSP-2186M uses an input clock
with a frequency equal to half the instruction rate. For example,
a 37.50 MHz input clock (which is equivalent to 26.6 ns) yields
a 13.3 ns processor cycle (equivalent to 75 MHz). tCK values
within the range of 0.5 tCKI period should be substituted for all
relevant timing parameters to obtain the specification value.
Example: tCKH = 0.5 tCK – 2 ns = 0.5 (15 ns) – 2 ns = 5.5 ns
ENVIRONMENTAL CONDITIONS
1
Rating
Description
Symbol
LQFP
Mini-BGA
Thermal Resistance
θCA
48
°C/W
63.3
°C/W
(Case-to-Ambient)
Thermal Resistance
θJA
50
°C/W
70.7
°C/W
(Junction-to-Ambient)
Thermal Resistance
θ
JC
2
°C/W
7.4
°C/W
(Junction-to-Case)
NOTE
1Where the Ambient Temperature Rating (T
AMB) is:
TAMB = TCASE – (PD
× θ
CA)
TCASE = Case Temperature in
°C
PD = Power Dissipation in W
POWER DISSIPATION
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C
× V
DD 2 × f
C = load capacitance, f = output switching frequency.
Example:
In an application where external data memory is used and no other
outputs are active, power dissipation is calculated as follows:
Assumptions:
External data memory is accessed every cycle with 50% of the
address pins switching.
External data memory writes occur every other cycle with
50% of the data pins switching.
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