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| 型号： | ADUM3301ARWZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/20页 |
| 文件大小： | 0K |
| 描述： | IC DIGITAL ISOLATOR 3CH 16-SOIC |
| 其它图纸： | ADUMx301 Series Diagram |
| 标准包装： | 47 |
| 系列： | iCoupler® |
| 输入 - 1 侧/2 侧： | 2/1 |
| 通道数： | 3 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 电压 - 隔离： | 2500Vrms |
| 数据速率： | 1Mbps |
| 传输延迟： | 65ns |
| 输出类型： | 逻辑 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 16-SOIC W |
| 包装： | 管件 |
| 工作温度： | -40°C ~ 105°C |
| 产品目录页面： | 2766 (CN2011-ZH PDF) |
Data Sheet
APPLICATION INFORMATION
PC BOARD LAYOUT
The ADuM330x digital isolator requires no external interface
circuitry for the logic interfaces. Power supply bypassing is
strongly recommended at the input and output supply pins (see
Figure 14). Bypass capacitors are most conveniently connected
between Pin 1 and Pin 2 for V DD1 and between Pin 15 and
Pin 16 for V DD2 . The capacitor value should be between 0.01 μF
and 0.1 μF. The total lead length between both ends of the
capacitor and the input power supply pin should not exceed
20 mm. Bypassing between Pin 1 and Pin 8 and between Pin 9
and Pin 16 should be considered unless the ground pair on each
ADuM3300/ADuM3301
While the ADuM330x improve system-level ESD reliability,
they are no substitute for a robust system-level design. See
Application Note AN-793 ESD/Latch-Up Considerations with
i Coupler Isolation Products for detailed recommendations on
board layout and system-level design.
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the time it takes
a logic signal to propagate through a component. The propagation
delay to a logic low output can differ from the propagation
delay to a logic high.
package side is connected close to the package.
INPUT (V IX )
50%
V DD1
GND 1
V IA
V IB
V DD2
GND 2
V OA
V OB
OUTPUT (V OX )
t PLH
t PHL
50%
V IC/OC
NC
V OC/IC
NC
Figure 15. Propagation Delay Parameters
V E1 V E2
GND 1 GND 2
Figure 14. Recommended Printed Circuit Board Layout
In applications involving high common-mode transients, care
should be taken to ensure that board coupling across the
isolation barrier is minimized. Furthermore, the board layout
should be designed such that any coupling that does occur
equally affects all pins on a given component side. Failure to
ensure this could cause voltage differentials between pins
exceeding the device’s absolute maximum ratings, thereby
leading to latch-up or permanent damage.
See the AN-1109 Application Note for board layout guidelines.
SYSTEM-LEVEL ESD CONSIDERATIONS AND
ENHANCEMENTS
System-level ESD reliability (for example, per IEC 61000-4-x) is
highly dependent on system design, which varies widely by
application. The ADuM330x incorporate many enhancements
to make ESD reliability less dependent on system design. The
enhancements include
? ESD protection cells added to all input/output interfaces.
? Key metal trace resistances reduced using wider geometry
and paralleling of lines with vias.
? The SCR effect inherent in CMOS devices minimized by
use of guarding and isolation technique between PMOS
and NMOS devices.
? Areas of high electric field concentration eliminated using
45° corners on metal traces.
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of how
accurately the input signal’s timing is preserved.
Channel-to-channel matching refers to the maximum amount
the propagation delay differs between channels within a single
ADuM330x component.
Propagation delay skew refers to the maximum amount the
propagation delay differs between multiple ADuM330x
components operating under the same conditions.
DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent to the decoder via the transformer.
The decoder is bistable and is, therefore, either set or reset by
the pulses, indicating input logic transitions. In the absence of
logic transitions at the input for more than ~1 μs, a periodic set
of refresh pulses indicative of the correct input state is sent to
ensure dc correctness at the output. If the decoder receives no
internal pulses of more than about 5 μs, the input side is
assumed to be unpowered or nonfunctional, in which case the
isolator output is forced to a default state (see Table 11) by the
watchdog timer circuit.
The limitation on the ADuM330x ’s magnetic field immunity is
set by the condition in which induced voltage in the transformer’s
receiving coil is sufficiently large to either falsely set or reset the
decoder. The following analysis defines the conditions under
which this can occur. The 3 V operating condition of the
ADuM330x is examined because it represents the most
?
Supply pin overvoltage prevented with larger ESD clamps
susceptible mode of operation.
between each supply pin and its respective ground.
Rev. C | Page 17 of 20
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| ADUM3301ARWZ-RL | 功能描述:IC DIGITAL ISOLATOR 3CH 16-SOIC RoHS:是 类别:隔离器 >> 数字隔离器 系列:iCoupler® 产品培训模块:IsoLoop® Isolator 标准包装:50 系列:IsoLoop® 输入 - 1 侧/2 侧:5/0 通道数:5 电源电压:3 V ~ 5.5 V 电压 - 隔离:2500Vrms 数据速率:110Mbps 传输延迟:12ns 输出类型:CMOS 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC N 包装:管件 工作温度:-40°C ~ 85°C 其它名称:390-1053-5 |
| ADUM3301BRWZ | 功能描述:IC DIGITAL ISOLATOR 3CH 16-SOIC RoHS:是 类别:隔离器 >> 数字隔离器 系列:iCoupler® 标准包装:66 系列:iCoupler® 输入 - 1 侧/2 侧:2/2 通道数:4 电源电压:3.3V，5V 电压 - 隔离:2500Vrms 数据速率:25Mbps 传输延迟:60ns 输出类型:逻辑 封装/外壳:20-SSOP（0.209"，5.30mm 宽） 供应商设备封装:20-SSOP 包装:管件 工作温度:-40°C ~ 105°C |
| ADUM3301BRWZ-RL | 功能描述:IC DIGITAL ISOLATOR 3CH 16-SOIC RoHS:是 类别:隔离器 >> 数字隔离器 系列:iCoupler® 产品培训模块:IsoLoop® Isolator 标准包装:50 系列:IsoLoop® 输入 - 1 侧/2 侧:5/0 通道数:5 电源电压:3 V ~ 5.5 V 电压 - 隔离:2500Vrms 数据速率:110Mbps 传输延迟:12ns 输出类型:CMOS 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC N 包装:管件 工作温度:-40°C ~ 85°C 其它名称:390-1053-5 |
| ADUM3301CRWZ | 功能描述:IC DIGITAL ISOLATOR 3CH 16-SOIC RoHS:是 类别:隔离器 >> 数字隔离器 系列:iCoupler® 标准包装:66 系列:iCoupler® 输入 - 1 侧/2 侧:2/2 通道数:4 电源电压:3.3V，5V 电压 - 隔离:2500Vrms 数据速率:25Mbps 传输延迟:60ns 输出类型:逻辑 封装/外壳:20-SSOP（0.209"，5.30mm 宽） 供应商设备封装:20-SSOP 包装:管件 工作温度:-40°C ~ 105°C |
| ADUM3301CRWZ-RL | 功能描述:IC DIGITAL ISOLATOR 3CH 16-SOIC RoHS:是 类别:隔离器 >> 数字隔离器 系列:iCoupler® 产品培训模块:IsoLoop® Isolator 标准包装:50 系列:IsoLoop® 输入 - 1 侧/2 侧:5/0 通道数:5 电源电压:3 V ~ 5.5 V 电压 - 隔离:2500Vrms 数据速率:110Mbps 传输延迟:12ns 输出类型:CMOS 封装/外壳:16-SOIC（0.154"，3.90mm 宽） 供应商设备封装:16-SOIC N 包装:管件 工作温度:-40°C ~ 85°C 其它名称:390-1053-5 |
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