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参数资料
| 型号： | ADV3003ACPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC EQUALZR HDMI/DVI TMDS 40LFCSP |
| 标准包装： | 1 |
| 应用： | DVI，HDMI 均衡器/驱动器 |
| 接口： | TMDS |
| 电源电压： | 3 V ~ 3.6 V |
| 封装/外壳： | 40-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 40-LFCSP-VQ（6x6） |
| 包装： | 托盘 |
| 安装类型： | 表面贴装 |
ADV3003
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
AVCC to AVEE
3.7 V
VTTI
AVCC + 0.6 V
VTTO
AVCC + 0.6 V
Internal Power Dissipation
2.0 W
High Speed Input Voltage
AVCC 1.4 V < VIN <
AVCC + 0.6 V
High Speed Differential Input Voltage
2.0 V
Parallel Interface (TX_EN, PE_EN)
AVEE 0.3 V < VIN <
AVCC + 0.6 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a 4-layer JEDEC circuit board for surface-mount
packages. JC is specified for the exposed pad soldered to the
circuit board with no airflow.
Table 3.
Package Type
θJA
θJC
Unit
40-Lead LFCSP
31.9
2.6
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the ADV3003
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can result
in device failure. To ensure proper operation, it is necessary to
observe the maximum power derating as determined by the
thermal resistance coefficients.
ESD CAUTION
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相关代理商/技术参数 |
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| ADV3003ACPZ-R7 | 功能描述:IC EQUALZR HDMI/DVI TMDS 40LFCSP RoHS:是 类别:集成电路 (IC) >> 接口 - 专用 系列:- 特色产品:NXP - I2C Interface 标准包装:1 系列:- 应用:2 通道 I²C 多路复用器 接口:I²C，SM 总线 电源电压:2.3 V ~ 5.5 V 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:剪切带 (CT) 安装类型:表面贴装 产品目录页面:825 (CN2011-ZH PDF) 其它名称:568-1854-1 |
| ADV3003-EVALZ | 制造商:Analog Devices 功能描述:EVAL KIT FOR HDMI/DVI PERCENTDS EQUALIZER - Bulk |
| ADV3014KSTZ | 功能描述:IC MUX HDMI FAST SW LQFP RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关，多路复用器，多路分解器 系列:* 其它有关文件:STG4159 View All Specifications 标准包装:5,000 系列:- 功能:开关 电路:1 x SPDT 导通状态电阻:300 毫欧 电压电源:双电源 电压 - 电源，单路/双路(±):±1.65 V ~ 4.8 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:7-WFBGA，FCBGA 供应商设备封装:7-覆晶 包装:带卷 (TR) |
| ADV30635210 | 制造商:LG Corporation 功能描述:Frame Assembly |
| ADV30639709 | 制造商:LG Corporation 功能描述:Frame Assembly, Display |
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