参数资料
型号: AFCT-5745TPZ
元件分类: 光收发
英文描述: FIBER OPTIC TRANSCEIVER, 1270-1360nm, 2700Mbps(Tx), 2700Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR
封装: ROHS COMPLIANT, PLASTIC, DIP-20
文件页数: 12/18页
文件大小: 524K
代理商: AFCT-5745TPZ
3
Quantizer IC
PIN Photodiode
& Pre-Amplifier
Sub-Assembly
-
Laser Diode
Driver Controller
Laser Diode &
Monitor Diode
Sub-Assembly
-
Digital Diagnostics Supervisor
Memory
Optical Monitor
Analog to Digital
Conversion
Temperature Sensor
Supply Voltage Sensor
-
Hot-Plug Control
Laser Diode
Current Driver
LOS
RD+
RD
-
TD+
TD
-
Tx Disable
Tx Fault
Serial Data
Serial Clock
20
19
18
17
16
15
14
13
12
11
V
EET
TD-
TD+
V
EET
V
CCT
V
CCR
V
EER
RD+
RD-
V
EER
1
2
3
4
5
6
7
8
9
10
V
EET
Tx FAULT
TxDISABLE
MOD-DEF(2)
MOD-DEF(1)
MOD-DEF(0)
RATE SELECT
LOS
V
EER
V
EER
TOP OF BOARD
BOTTOM OF BOARD
(AS VIEWED THROUGH TOP OF BOARD)
Module Description
The transceiver meets the Small Form Pluggable (SFP)
industry standard package utilizing an integral LC-Duplex
optical interface connector. The hot-pluggable capabil-
ity of the SFP package allows the module to be installed
at any time - even with the host system operating and
on-line. This allows for system configuration changes or
maintenance without system down time.
Module Diagrams
Figure 1 illustrates the major functional components of
the AFCT-5745Z. The connection diagram of the mod-
ule is shown in Figure 2. Figure 3 depicts the external
configuration of the module. Figure 4 depicts the MSA
recommended power supply filter.
Installation
The AFCT-5745Z can be installed in or removed from any
Multisource Agreement (MSA) –compliant Small Form
Pluggable port regardless of whether the host equip-
ment is operating or not. The module is simply inserted,
electrical interface first, under finger pressure. Controlled
hot-plugging is ensured by design and by 3-stage pin
sequencing at the electrical interface. The module
housing makes initial contact with the host board EMI
shield mitigating potential damage due to Electro-Static
Discharge (ESD). The 3-stage pin contact sequencing
involves (1) Ground, (2) Power, and then (3) Signal pins,
making contact with the host board surface mount con-
nector in that order.
Figure 1. Transceiver Functional Block Diagram
Figure 2. Connection Diagram of Module Printed Circuit Board
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