- 您现在的位置：买卖IC网 > PDF目录64096 > AG602-89G 0 MHz - 3500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER PDF资料下载
参数资料
| 型号： | AG602-89G |
| 元件分类： | 放大器 |
| 英文描述： | 0 MHz - 3500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | GREEN, SMT, TO-243, SOT-89, 3 PIN |
| 文件页数： | 5/5页 |
| 文件大小： | 199K |
| 代理商： | AG602-89G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com, www.TriQuint.com
Page 5 of 5 January 2008
AG602-89
InGaP HBT Gain Block
AG602-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C reflow temperature) and leaded
(maximum 245
°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The AG602-89G will be marked with an
“A602G” designator with an alphanumeric
lot code marked below the part designator.
The obsolete tin-lead package is marked with
an “AG602” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Passes
≥ 1000V min.
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
≥ 1000V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink.
Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
A602G
XXXX-X
相关PDF资料 |
PDF描述 |
|---|---|
| AG603-89G | 0 MHz - 3000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG604-89G | 0 MHz - 2700 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG606-G | 50 MHz - 860 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AGC-553 | 10 MHz - 500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AGC-7-30/10AC | 25 MHz - 35 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AG602-89PCB | 功能描述:射频开发工具 700-2400MHz Eval Brd 18.5dBm 14dB Gain RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| AG602-89-RFID | 制造商:WJCI 制造商全称:WJCI 功能描述:InGaP HBT Gain Block |
| AG602-89TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG603 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:InGaP HBT Gain Block |
| AG6030P-SM | 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL |
发布紧急采购，3分钟左右您将得到回复。