参数资料
型号: AGLE600V2-FFGG484C
元件分类: FPGA
英文描述: FPGA, 13824 CLBS, 600000 GATES, PBGA256
封装: 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, FBGA-256
文件页数: 62/156页
文件大小: 5023K
代理商: AGLE600V2-FFGG484C
Package Pin Assignments
3- 26
v1.1
Part Number and Revision Date
Part Number 51700096-003-1
Revised June 2008
List of Changes
The following table lists critical changes that were made in the current version of the chapter.
Previous Version
Changes in Current Version (v1.1)
Page
v1.0
(January 2008)
The naming conventions changed for the following pins in the "484-Pin
FBGA" for the A3GLE600:
Pin Number
New Function Name
J19
IO45PPB2V1
K20
IO45NPB2V1
M2
IO114NPB6V1
N1
IO114PPB6V1
N4
GFC2/IO115PPB6V1
P3
IO115NPB6V1
Advance v0.4
(December 2007)
This document was previously in datasheet Advance v0.4. As a result of
moving to the handbook format, Actel has restarted the version numbers. The
new version number is v1.0.
N/A
Advance v0.3
(September 2007)
The "484-Pin FBGA" table for AGLE3000 is new.
4-11
The "896-Pin FBGA" package and table for AGLE3000 is new.
4-16
相关PDF资料
PDF描述
AGLE600V2-FG256C FPGA, 13824 CLBS, 600000 GATES, PBGA256
AGLE600V2-FGG256C FPGA, 13824 CLBS, 600000 GATES, PBGA256
AGLE600V2-FGG484C FPGA, 13824 CLBS, 600000 GATES, PBGA256
AGLE600V5-FFG256C FPGA, 13824 CLBS, 600000 GATES, PBGA256
AGLE600V5-FFG484C FPGA, 13824 CLBS, 600000 GATES, PBGA256
相关代理商/技术参数
参数描述
AGLE600V2-FFGG896 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FFGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FFGG896I 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FFGG896PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FG256 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)