参数资料
型号: AGLE600V5-FGG256
厂商: Microsemi SoC
文件页数: 105/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
标准包装: 90
系列: IGLOOe
逻辑元件/单元数: 13824
RAM 位总计: 110592
输入/输出数: 165
门数: 600000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
IGLOOe Low Power Flash FPGAs
Revision 13
2-29
3.3 V PCI/PCI-X
Per PCI/PCI-X
specification
25
75
3.3 V GTL
20 mA5
11
2.5 V GTL
20 mA5
14
3.3 V GTL+
35 mA
12
2.5 V GTL+
33 mA
15
HSTL (I)
8 mA
50
HSTL (II)
15 mA
25
SSTL2 (I)
15 mA
27
31
SSTL2 (II)
18 mA
13
15
SSTL3 (I)
14 mA
44
69
SSTL3 (II)
21 mA
18
32
Table 2-29 I/O Weak Pull-Up/Pull-Down Resistances
Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values
VCCI
R((WEAK PULL-UP)1
(
)
R(WEAK PULL-DOWN)2
(
)
Minimum
Maximum
Minimum
Maximum
3.3 V
10 k
45 k
10 k
45 k
3.3 V (wide range I/Os)
10 k
45 k
10 k
45 k
2.5 V
11 k
55 k
12 k
74 k
1.8 V
18 k
70 k
17 k
110 k
1.5 V
19 k
90 k
19 k
140 k
1.2 V
25 k
110 k
25 k
150 k
1.2 V (wide range I/Os)
19 k
110 k
19 k
150 k
Notes:
1. R(WEAK PULL-UP-MAX) = (VCCImax – VOHspec) / I(WEAK PULL-UP-MIN)
2. R(WEAK PULL-DOWN-MAX) = (VOLspec) / I(WEAK PULL-DOWN-MIN)
Table 2-28 I/O Output Buffer Maximum Resistances1 (continued)
Standard
Drive Strength
RPULL-DOWN ()2
RPULL-UP ()3
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance values depend
on VCCI, drive strength selection, temperature, and process. For board design considerations and detailed output buffer
resistances, use the corresponding IBIS models located on the Microsemi SoC Products Group website at
http://www.microsemi.com/soc/techdocs/models/ibis.html.
2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
4. Applicable to IGLOOe V2 devices operating in the 1.2 V core range ONLY.
5. Output drive strength is below JEDEC specification.
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